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IKCM10H60GA

Infineon Technologies

IKCM10H60GA by Infineon Technologies

Infineon's IKCM10H60GA is a Motion Control IC with 16A output current, suitable for AC motor control. Operating temperature range from -40 to 100°C, with supply voltage of 14.5-18.5V. Rectangular package style, 24 terminals, and industrial grade make it ideal for various motion control applications.

Median Price

$6.040

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 53 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

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53

$6.000

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-

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Digiode

USA . 838 parts In-Stock

1+ parts

$9.852

100+ parts

-

1k+ parts

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838

$9.852

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Rutronik

Germany . 280 parts In-Stock

1+ parts

-

100+ parts

$6.040

1k+ parts

-

10k+ parts

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280

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$6.040

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 950 parts In-Stock

1+ parts

$9.333

100+ parts

-

1k+ parts

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10k+ parts

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950

$9.333

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Modulus Dynamics

Lithuania . 4,316 parts In-Stock

1+ parts

$13.080

100+ parts

$12.557

1k+ parts

$12.034

10k+ parts

-

4,316

$13.080

$12.557

$12.034

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A-Z Elektronik GmbH

Germany . 7,685 parts In-Stock

1+ parts

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7,685

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Alle Elektronik GmbH

Germany . 4,003 parts In-Stock

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4,003

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Assy Fe

Spain . 1,350 parts In-Stock

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1,350

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Overview

Infineon Technologies CIPOS™ Intelligent Power Modules (IPM) are a portfolio of highly integrated, compact power modules designed to drive motors in applications ranging from home appliances, fans, and pumps to general-purpose drives. The modules are designed to drive motors in applications like home appliances, fans, pumps, and general-purpose drives. The CIPOS family consists of ultra-compact nano, cost-effective micro, and energy-efficient mini IPMs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and cost-effective.

Nominal Supply Voltage (Vsup): 16 V

The nominal supply voltage of 16 V ensures efficient power usage and compatibility with a wide range of applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate effectively in cold temperatures.

Maximum Output Current: 16 A

The high maximum output current of 16 A allows for driving powerful motors and devices with ease.

Technical Specifications

Motion Control ICs IKCM10H60GA attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDMA-T24

Length:

36 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

16 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

5.6 mm

Maximum Supply Voltage (Vsup):

18.5 V

Minimum Supply Voltage (Vsup):

14.5 V

Nominal Supply Voltage (Vsup):

16 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

21 mm

Trade Compliance

IKCM10H60GA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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