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IGT60R190D1SATMA1

Infineon Technologies

IGT60R190D1SATMA1 by Infineon Technologies

Infineon's IGT60R190D1SATMA1 is a N-CHANNEL FET for SWITCHING applications. With 600V DS Breakdown Voltage, it offers 23A IDM and 0.19 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this GaN transistor has a max power dissipation of 55.5W and operates b/w -55 to 150 °C.

Median Price

$1.613

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$1.613

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1

$1.613

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Verical

USA . 1 parts In-Stock

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$1.613

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1

$1.613

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Chip1Stop

Japan . 1 parts In-Stock

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$8.210

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1

$8.210

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TME

Poland . 3 parts In-Stock

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$7.300

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3

$7.300

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Digiode

USA . 121 parts In-Stock

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$7.590

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$7.590

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Nova Conductors

Japan . 65 parts In-Stock

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$9.652

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$9.652

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Vyrian

USA . 5,101 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 19,289 parts In-Stock

1+ parts

$1.304

100+ parts

$1.252

1k+ parts

$1.200

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19,289

$1.304

$1.252

$1.200

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Aztec Data Supply Inc.

USA . 316 parts In-Stock

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$1.548

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316

$1.548

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Corohmni

South Africa . 204 parts In-Stock

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$1.768

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204

$1.768

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$1.930

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$1.930

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Semicontronic

India . 1 parts In-Stock

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$1.930

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$1.882

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$1.872

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$1.930

$1.882

$1.872

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Corphita

USA . 168 parts In-Stock

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$7.191

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$10.600

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$8.420

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$10.600

$8.420

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AZTECH Wire

Italy . 393 parts In-Stock

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$13.421

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$13.421

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Robosynatics

Brazil . 18,670 parts In-Stock

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$1.730

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$1.694

10k+ parts

$1.694

18,670

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$1.730

$1.694

$1.694

Lucentia Tech

USA . 18,670 parts In-Stock

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$1.730

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$1.694

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$1.694

18,670

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$1.730

$1.694

$1.694

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Perfect Parts

USA . 2,241 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$9.459

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$9.169

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$8.976

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$8.976

Argo Parts USA

USA . 84 parts In-Stock

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Overview

Unleash the power of innovation with the IGT60R190D1SATMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for a variety of switching applications. With a maximum DS Breakdown Voltage of 600 V and a Maximum Drain Current of 12.5 A, this N-CHANNEL transistor offers enhanced performance and reliability. Say goodbye to inefficiency and hello to seamless operation with this advanced technology. Upgrade your systems today with the IGT60R190D1SATMA1 and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal properties and durability, making the transistor suitable for a variety of operating conditions.

Polarity or Channel Type: N-CHANNEL

Enhances the efficiency and performance of the transistor in switching applications.

Configuration: SINGLE

Simplifies the design and reduces complexity for integration into circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance.

Surface Mount: YES

Easy to mount on circuit boards, saving space and facilitating manufacturing processes.

Minimum DS Breakdown Voltage: 600 V

Allows for high voltage operation, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 23 A

Capable of handling high current surges, ensuring robustness in demanding conditions.

Maximum Power Dissipation (Abs): 55.5 W

Can dissipate heat effectively, preventing overheating and maintaining reliability.

Maximum Operating Temperature: 150 °C

Suitable for use in high-temperature environments, increasing versatility.

Maximum Drain Current (ID): 12.5 A

Capable of handling high continuous currents, enhancing overall performance.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance minimizes power loss and improves efficiency during operation.

Maximum Feedback Capacitance (Crss): 0.15 pF

Low feedback capacitance reduces signal distortion and improves performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) IGT60R190D1SATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

12.5 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.15 pF

JESD-30 Code:

R-PSSO-F3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

23 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

IGT60R190D1SATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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