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IDC73D120T6HX1SA2

Infineon Technologies

IDC73D120T6HX1SA2 by Infineon Technologies

IDC73D120T6HX1SA2 by Infineon Technologies is a SCHOTTKY RECTIFIER DIODE with 1200V VRRM and 150A Iout. It operates b/w -40°C to 175°C, featuring fast soft recovery for high-power applications. This surface-mount diode in rectangular package is ideal for power electronics and industrial equipment.

Median Price

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3

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1k+

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Vyrian

USA . 838 parts In-Stock

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Digiode

USA . 623 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 408 parts In-Stock

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$0.033

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.055

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$0.052

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$0.055

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Aztec Data Supply Inc.

USA . 4,653 parts In-Stock

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$0.080

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Modulus Dynamics

Lithuania . 8,781 parts In-Stock

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$0.126

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$0.121

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Semicontronic

India . 705 parts In-Stock

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$1.010

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$0.985

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$0.980

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Ampacity Inc.

Singapore . 131 parts In-Stock

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AZTECH Wire

Italy . 285 parts In-Stock

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$15.605

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Andel Nordic

Denmark . 56 parts In-Stock

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Argo Parts USA

USA . 4,121 parts In-Stock

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Continental Prestige Electronics

USA . 4,083 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the IDC73D120T6HX1SA2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees unparalleled quality and reliability in their diodes & rectifiers. Designed for fast soft recovery applications, this product offers a maximum output current of 150A and a maximum repetitive peak reverse voltage of 1200V. With a wide operating temperature range and SCHOTTKY technology, customers can trust in the superior performance and durability of this product. Experience seamless integration with its surface mount capability and rectangular package shape. Elevate your projects to new heights with the IDC73D120T6HX1SA2 and discover the difference that excellence in innovation can make.

Feature Benefit Bullets

Config: SINGLE

Single configuration makes it easy to use and compatible with most applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB.

Application: FAST SOFT RECOVERY

Fast soft recovery ensures quick and smooth operation, increasing efficiency.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliability even under extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments.

Diode Type: RECTIFIER DIODE

Rectifier diode type is suitable for converting AC to DC efficiently.

Maximum Forward Voltage (VF): 1.8 V

Low forward voltage drop ensures minimal power loss during operation.

Maximum Output Current: 150 A

High output current capability allows for handling large loads.

Technology: SCHOTTKY

Schottky technology ensures low forward voltage drop and fast switching speeds.

Terminal Form: NO LEAD

No-lead terminal form makes it suitable for surface mount applications.

Maximum Repetitive Peak Reverse Voltage: 1200 V

High maximum repetitive peak reverse voltage provides protection against voltage spikes.

Maximum Non Repetitive Peak Forward Current: 25 A

Can handle short-term high forward currents without damage, increasing reliability.

Diode Element Material: SILICON

Silicon diode element material offers high efficiency and reliability.

Technical Specifications

Diodes & Rectifiers IDC73D120T6HX1SA2 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Application:

FAST SOFT RECOVERY

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.8 V

JESD-30 Code:

R-XUUC-N1

Maximum Non Repetitive Peak Forward Current:

25 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

1

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

150 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

1200 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

IDC73D120T6HX1SA2 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.40

SB

8541.10.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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