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ICE2A365

Infineon Technologies

ICE2A365 by Infineon Technologies

ICE2A365 by Infineon Technologies is a switching regulator with 3A output current and 107kHz switching frequency. It operates b/w -25 to 125°C, ideal for various applications requiring pulse width modulation control technique in a compact rectangular package.

Median Price

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Lifecycle Status

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Digiode

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Ack Elektronik San.Tic.Ltd.Sti

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Vyrian

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Nova Conductors

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Fibra_Brandt Electronic GMBH

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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LittleDiode

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Modulus Dynamics

Lithuania . 4,662 parts In-Stock

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$1.104

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$1.058

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Corohmni

South Africa . 248 parts In-Stock

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Semicontronic

India . 930 parts In-Stock

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Advanced Electronics

New Zealand . 150 parts In-Stock

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Andel Nordic

Denmark . 249 parts In-Stock

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Continental Prestige Electronics

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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GreenTree Electronics

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Corphita

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Overview

Discover the power and efficiency of the ICE2A365 by Infineon Technologies, a top-of-the-line switching regulator designed to optimize performance in a wide range of applications. Manufactured with precision and expertise, this product offers customers unparalleled quality and reliability. With its current-mode control mode and pulse width modulation technique, the ICE2A365 delivers seamless operation and maximum output current of 3A. Say goodbye to inefficiency and hello to superior performance with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

No. of Terminals: 8

Having multiple terminals allows for versatile connectivity options and flexibility in application.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable performance even in harsh environments.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and stability, improving overall efficiency.

Maximum Output Current: 3 A

The high output current capacity allows for powering a variety of devices and components.

Control Technique: PULSE WIDTH MODULATION

PWM control technique offers precise regulation and efficiency, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers ICE2A365 attributes and parameters. Explore more Switching Regulators & Controllers devices from Infineon Technologies

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

21 V

Minimum Input Voltage:

8.5 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDIP-T8

Length:

9.52 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.37 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

107 kHz

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

ICE2A365 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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