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HDSP2003LP

Infineon Technologies

HDSP2003LP by Infineon Technologies

HDSP2003LP by Infineon Technologies is a 4mm LED display with peak wavelength of 565nm, ideal for applications requiring green color output. It operates b/w -40°C to 85°C, making it suitable for various environments. The terminal finish is Tin/Lead (Sn/Pb), ensuring reliable connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 769 parts In-Stock

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769

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Vyrian

USA . 474 parts In-Stock

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474

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Fibra_Brandt Electronic GMBH

Germany . 6 parts In-Stock

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R&J Components

USA . 1 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 6,695 parts In-Stock

1+ parts

$0.786

100+ parts

$0.755

1k+ parts

$0.723

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6,695

$0.786

$0.755

$0.723

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AZTECH Wire

Italy . 457 parts In-Stock

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$11.874

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457

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Ampacity Inc.

Singapore . 663 parts In-Stock

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$20.100

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663

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Continental Prestige Electronics

USA . 3,541 parts In-Stock

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Argo Parts USA

USA . 1,345 parts In-Stock

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Assy Fe

Spain . 515 parts In-Stock

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515

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corphita

USA . 228 parts In-Stock

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Overview

Elevate your visual displays with the HDSP2003LP LED Display by Infineon Technologies. Known for their top-notch quality and innovative technology, Infineon delivers products that exceed expectations. Ideal for a wide range of applications, this green LED display offers vibrant colors and sharp clarity. Elevate your projects and captivate your audience with the HDSP2003LP's superior performance and reliability. Upgrade to the best in LED displays today.

Feature Benefit Bullets

Peak Wavelength (nm) 565

This specific wavelength of the LED display ensures a bright and vibrant green color, making it visually appealing.

Maximum Operating Temperature 85 °C

The high maximum operating temperature allows for reliable performance even in warmer environments, increasing the versatility of the product.

Minimum Operating Temperature -40 °C

The low minimum operating temperature ensures that the LED display can function effectively even in colder conditions, making it suitable for a wider range of applications.

Terminal Finish Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and reliability, ensuring a strong connection and durability of the LED display.

No. of Characters 4

With 4 characters, this LED display is ideal for displaying short and concise information, making it perfect for various applications such as clocks, timers, and small message displays.

Color At Wavelength Green

The green color output at the specified wavelength provides high visibility and clear readability, making it suitable for applications where visibility is crucial.

Display Height 4 mm

The 4mm display height offers good readability and visibility for the characters displayed on the LED display, making it easy to view from a distance.

Technical Specifications

LED Displays HDSP2003LP attributes and parameters. Explore more LED Displays devices from Infineon Technologies

Specs

Color At Wavelength:

Green

Configuration:

N/A

Display Height:

4 mm

JESD-609 Code:

e0

No. of Characters:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Peak Wavelength (nm):

565

Sub-Category:

LED Displays

Terminal Finish:

Trade Compliance

HDSP2003LP Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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