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DAPMINIWIGGLERUSBTOBO1

Infineon Technologies

DAPMINIWIGGLERUSBTOBO1 by Infineon Technologies

Limited Part Number Data;

Median Price

$89.700

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 329 parts In-Stock

1+ parts

$76.070

100+ parts

-

1k+ parts

-

10k+ parts

-

329

$76.070

-

-

-

DigiKey

USA . 261 parts In-Stock

1+ parts

$86.650

100+ parts

-

1k+ parts

-

10k+ parts

-

261

$86.650

-

-

-

Newark

USA . 37 parts In-Stock

1+ parts

$87.900

100+ parts

-

1k+ parts

-

10k+ parts

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37

$87.900

-

-

-

Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$91.500

100+ parts

-

1k+ parts

-

10k+ parts

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8

$91.500

-

-

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Farnell

UK . 5 parts In-Stock

1+ parts

$114.770

100+ parts

-

1k+ parts

-

10k+ parts

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5

$114.770

-

-

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Verical

USA . 1 parts In-Stock

1+ parts

$181.050

100+ parts

-

1k+ parts

-

10k+ parts

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1

$181.050

-

-

-

EBV Elektronik

Germany . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 939 parts In-Stock

1+ parts

$109.032

100+ parts

-

1k+ parts

-

10k+ parts

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939

$109.032

-

-

-

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$143.410

100+ parts

-

1k+ parts

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62

$143.410

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Vyrian

USA . 5,222 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,222

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$11.534

100+ parts

-

1k+ parts

-

10k+ parts

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873

$11.534

-

-

-

Ampacity Inc.

Singapore . 23 parts In-Stock

1+ parts

$97.550

100+ parts

-

1k+ parts

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23

$97.550

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-

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Corphita

USA . 279 parts In-Stock

1+ parts

$103.293

100+ parts

-

1k+ parts

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10k+ parts

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279

$103.293

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$140.542

100+ parts

-

1k+ parts

$134.920

10k+ parts

-

2,000

$140.542

-

$134.920

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Continental Prestige Electronics

USA . 6,147 parts In-Stock

1+ parts

$143.410

100+ parts

-

1k+ parts

-

10k+ parts

$140.542

6,147

$143.410

-

-

$140.542

Argo Parts USA

USA . 2,579 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,579

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

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-

Technical Specifications

Additional Parts DAPMINIWIGGLERUSBTOBO1 attributes and parameters. Explore more Additional Parts devices from Infineon Technologies

Technical Specifications

Other Names:

SP000700490
448-DAPMINIWIGGLERUSBTOBO1

Series:

AURIX™

Type:

Debugger

Category:

Development Boards, Kits, Programmers
Programmers, Emulators, and Debuggers

Contents:

Board(s)

For Use With/Related Products:

MCU

Package:

Bulk

Standard Package:

1

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAPMINIWIGGLERUSBTOBO1 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8543.70.9860

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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