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CYT4BB5CEBQ1AEEGS

Infineon Technologies

CYT4BB5CEBQ1AEEGS by Infineon Technologies

Infineon CYT4BB5CEBQ1AEEGS is a 32-bit microcontroller with Cortex-M7 CPU family, offering 72 external interrupts and 83 timers. It features 39-ch ADC, 166 DMA channels, and CAN, Ethernet connectivity. Ideal for applications requiring low power mode, with max clock frequency of 80 MHz.

Median Price

$26.355

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 900 parts In-Stock

1+ parts

$25.820

100+ parts

$18.440

1k+ parts

$18.250

10k+ parts

-

900

$25.820

$18.440

$18.250

-

Mouser Electronics

USA . 299 parts In-Stock

1+ parts

$26.350

100+ parts

$20.750

1k+ parts

$19.800

10k+ parts

-

299

$26.350

$20.750

$19.800

-

DigiKey

USA . 894 parts In-Stock

1+ parts

$26.360

100+ parts

$20.758

1k+ parts

$18.846

10k+ parts

-

894

$26.360

$20.758

$18.846

-

Element14

Singapore . 900 parts In-Stock

1+ parts

$80.041

100+ parts

$52.636

1k+ parts

-

10k+ parts

-

900

$80.041

$52.636

-

-

Farnell

UK . 900 parts In-Stock

1+ parts

$81.624

100+ parts

$53.056

1k+ parts

-

10k+ parts

-

900

$81.624

$53.056

-

-

Rochester

USA . 2,293 parts In-Stock

1+ parts

-

100+ parts

$14.090

1k+ parts

$12.610

10k+ parts

$11.860

2,293

-

$14.090

$12.610

$11.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 637 parts In-Stock

1+ parts

$25.032

100+ parts

-

1k+ parts

-

10k+ parts

-

637

$25.032

-

-

-

Vyrian

USA . 903 parts In-Stock

1+ parts

$26.350

100+ parts

-

1k+ parts

-

10k+ parts

-

903

$26.350

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 558 parts In-Stock

1+ parts

$1.271

100+ parts

-

1k+ parts

-

10k+ parts

-

558

$1.271

-

-

-

Northwest PG Solutions

USA . 596 parts In-Stock

1+ parts

$1.398

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$1.398

-

-

-

Corphita

USA . 151 parts In-Stock

1+ parts

$23.715

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$23.715

-

-

-

Continental Prestige Electronics

USA . 900 parts In-Stock

1+ parts

$55.490

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$55.490

-

-

-

Microchip USA

USA . 2,034 parts In-Stock

1+ parts

$58.350

100+ parts

$57.340

1k+ parts

$56.830

10k+ parts

$56.320

2,034

$58.350

$57.340

$56.830

$56.320

Overview

Experience the next level of performance with the CYT4BB5CEBQ1AEEGS microcontroller by Infineon Technologies. Built with cutting-edge technology and a focus on quality, this microcontroller offers unparalleled advantages for a wide range of applications. From its integrated cache to its low power mode, customers can expect superior value and benefits from this product. Discover the possibilities and unlock new opportunities with the CYT4BB5CEBQ1AEEGS microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making the product suitable for various environments.

Integrated Cache: YES

Integrated cache helps in improving the overall performance and speed of the microcontroller.

Surface Mount: YES

Surface mount design makes it easy to integrate this microcontroller into different projects and applications.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V ensures safe operation and protects the microcontroller from overvoltage damage.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 enhances data processing capabilities and efficiency.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it suitable for space-constrained designs.

Bit Size: 32

The 32-bit architecture provides higher processing power and performance compared to lower bit sizes.

No. of Terminals: 100

Having a high number of terminals allows for a wide range of connectivity options and flexibility in design.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles offer versatility in mounting options and suit different application requirements.

Minimum Supply Voltage: 1.05 V

The minimum supply voltage of 1.05 V ensures efficient power consumption and operation even at lower voltages.

Technical Specifications

Microcontrollers CYT4BB5CEBQ1AEEGS attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

166

No. of External Interrupts:

72

No. of I/O Lines:

72

No. of Terminals:

100

No. of Timers:

83

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

786432

ROM Words:

4259840

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

250 rpm

Maximum Supply Current:

287 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

CAN(8), ETHERNET, I2S(2), LIN(9), SCB(9)

Peripherals:

BOD, DMA(166), POR, RTC, TIMER(83), WDT

Analog To Digital Convertors:

39-Ch 12-Bit

Trade Compliance

CYT4BB5CEBQ1AEEGS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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