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CYT3BB8CEBQ0AESGS

Infineon Technologies

CYT3BB8CEBQ0AESGS by Infineon Technologies

Infineon CYT3BB8CEBQ0AESGS is a Cortex-M7 microcontroller with 32-bit architecture, 786432 bytes of RAM, and 64-Ch 12-Bit ADC channels. It is suitable for applications requiring high-speed processing, extensive I/O connectivity (CAN, ETHERNET, I2C, SPI), and low power consumption.

Median Price

$18.100

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 395 parts In-Stock

1+ parts

$17.920

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$17.920

-

-

-

Farnell

UK . 400 parts In-Stock

1+ parts

$18.280

100+ parts

$13.840

1k+ parts

-

10k+ parts

-

400

$18.280

$13.840

-

-

DigiKey

USA . 397 parts In-Stock

1+ parts

$22.760

100+ parts

$16.634

1k+ parts

$15.214

10k+ parts

-

397

$22.760

$16.634

$15.214

-

Element14

Singapore . 400 parts In-Stock

1+ parts

$22.960

100+ parts

-

1k+ parts

-

10k+ parts

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400

$22.960

-

-

-

Rochester

USA . 529 parts In-Stock

1+ parts

-

100+ parts

$13.590

1k+ parts

$12.160

10k+ parts

$11.440

529

-

$13.590

$12.160

$11.440

Verical

USA . 529 parts In-Stock

1+ parts

-

100+ parts

$16.988

1k+ parts

$15.200

10k+ parts

$14.300

529

-

$16.988

$15.200

$14.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 974 parts In-Stock

1+ parts

$14.345

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$14.345

-

-

-

Bristol Electronics

USA . 37 parts In-Stock

1+ parts

$14.580

100+ parts

$14.019

1k+ parts

-

10k+ parts

-

37

$14.580

$14.019

-

-

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$21.151

100+ parts

-

1k+ parts

-

10k+ parts

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88

$21.151

-

-

-

Vyrian

USA . 4,176 parts In-Stock

1+ parts

-

100+ parts

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4,176

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-

-

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ACDS - Activité Composants Distribution Service

France . 37 parts In-Stock

1+ parts

-

100+ parts

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37

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Dan-Mar Components

USA . 37 parts In-Stock

1+ parts

-

100+ parts

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37

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 341 parts In-Stock

1+ parts

$12.830

100+ parts

-

1k+ parts

-

10k+ parts

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341

$12.830

-

-

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Corphita

USA . 703 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

-

10k+ parts

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703

$13.590

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$21.151

100+ parts

-

1k+ parts

$20.093

10k+ parts

$19.670

500

$21.151

-

$20.093

$19.670

Continental Prestige Electronics

USA . 400 parts In-Stock

1+ parts

$48.970

100+ parts

-

1k+ parts

-

10k+ parts

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400

$48.970

-

-

-

Microchip USA

USA . 1,182 parts In-Stock

1+ parts

$56.300

100+ parts

$55.320

1k+ parts

$54.840

10k+ parts

$54.350

1,182

$56.300

$55.320

$54.840

$54.350

Modulus Dynamics

Lithuania . 3,267 parts In-Stock

1+ parts

$57.353

100+ parts

$55.059

1k+ parts

$52.765

10k+ parts

-

3,267

$57.353

$55.059

$52.765

-

Argo Parts USA

USA . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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101

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-

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-

Overview

Discover the cutting-edge CYT3BB8CEBQ0AESGS microcontroller by Infineon Technologies, a top-tier manufacturer in the industry. Designed for high performance and reliability, this microcontroller boasts integrated cache, advanced peripherals, and low power consumption, making it ideal for various applications. With its impressive features and robust design, the CYT3BB8CEBQ0AESGS offers unmatched value and benefits to customers seeking top-notch quality and efficiency in their electronic devices. Experience the difference with this innovative microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache helps improve the microcontroller's processing speed and efficiency.

Maximum Supply Voltage: 1.15 V

The higher maximum supply voltage allows for more flexibility in power supply options.

On Chip Data RAM Width: 8

The wide data RAM width helps in handling larger amounts of data efficiently.

No. of Terminals: 176

Having a high number of terminals enables connectivity to a wide range of external components and peripherals.

Bit Size: 32

The 32-bit architecture allows for high-performance computing and processing capabilities.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can function reliably even in high-temperature environments.

No. of External Interrupts: 148

The large number of external interrupts allows the microcontroller to respond quickly to external events and signals.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to accurately convert analog signals to digital data for processing.

DMA Channels: YES

DMA channels help in efficient data transfer between peripherals and memory, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance with reduced instruction set computing, making it efficient for various applications.

Connectivity: CAN(8), ETHERNET, I2C(10), I2S(3), LIN(16), SPI(10), UART(10)

The versatile connectivity options make it suitable for a wide range of communication protocols and interfaces.

Technical Specifications

Microcontrollers CYT3BB8CEBQ0AESGS attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

166

No. of External Interrupts:

148

No. of I/O Lines:

148

No. of Serial I/Os:

38

No. of Terminals:

176

No. of Timers:

83

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

786432

ROM Words:

4259840

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

250 rpm

Maximum Supply Current:

287 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

CAN(8), ETHERNET, I2C(10), I2S(3), LIN(16), SPI(10), UART(10)

Peripherals:

BOD, DMA(166), POR, RTC, TIMER(83), WDT

Analog To Digital Convertors:

64-Ch 12-Bit

Trade Compliance

CYT3BB8CEBQ0AESGS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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