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CYPD3172-24LQXQ

Infineon Technologies

CYPD3172-24LQXQ by Infineon Technologies

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4,900 parts In-Stock

1+ parts

$0.995

100+ parts

$0.589

1k+ parts

$0.576

10k+ parts

$0.571

4,900

$0.995

$0.589

$0.576

$0.571

Arrow

USA . 4,900 parts In-Stock

1+ parts

$1.079

100+ parts

$0.825

1k+ parts

-

10k+ parts

-

4,900

$1.079

$0.825

-

-

DigiKey

USA . 4,900 parts In-Stock

1+ parts

$1.430

100+ parts

$0.854

1k+ parts

$0.812

10k+ parts

-

4,900

$1.430

$0.854

$0.812

-

Chip1Stop

Japan . 4,900 parts In-Stock

1+ parts

$1.562

100+ parts

$1.054

1k+ parts

$0.876

10k+ parts

-

4,900

$1.562

$1.054

$0.876

-

Newark

USA . 4,900 parts In-Stock

1+ parts

$1.840

100+ parts

$1.130

1k+ parts

$1.020

10k+ parts

$0.950

4,900

$1.840

$1.130

$1.020

$0.950

Element14

Singapore . 4,900 parts In-Stock

1+ parts

$2.660

100+ parts

$1.800

1k+ parts

$1.300

10k+ parts

$1.280

4,900

$2.660

$1.800

$1.300

$1.280

Rochester

USA . 9,795 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$0.913

10k+ parts

$0.814

9,795

-

$1.100

$0.913

$0.814

Verical

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,900

-

-

-

-

Flip Electronics (Authorized)

USA . 965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

965

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 122 parts In-Stock

1+ parts

$1.463

100+ parts

-

1k+ parts

-

10k+ parts

-

122

$1.463

-

-

-

Vyrian

USA . 598 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

10k+ parts

-

598

$1.540

-

-

-

Flip Electronics

USA . 965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

965

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 826 parts In-Stock

1+ parts

$1.386

100+ parts

-

1k+ parts

-

10k+ parts

-

826

$1.386

-

-

-

Continental Prestige Electronics

USA . 4,900 parts In-Stock

1+ parts

$1.440

100+ parts

$1.070

1k+ parts

$0.891

10k+ parts

-

4,900

$1.440

$1.070

$0.891

-

Modulus Dynamics

Lithuania . 1,044 parts In-Stock

1+ parts

$83.496

100+ parts

$80.156

1k+ parts

$76.816

10k+ parts

-

1,044

$83.496

$80.156

$76.816

-

Northwest PG Solutions

USA . 1,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,409

-

-

-

-

Native Components

USA . 199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

199

-

-

-

-

Technical Specifications

Power Management ICs CYPD3172-24LQXQ attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

21.5 V

Minimum Supply Voltage (Vsup):

3.3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

2.1

Width (mm):

4 mm

Trade Compliance

CYPD3172-24LQXQ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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