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CHL8212-02CRT

Infineon Technologies

CHL8212-02CRT by Infineon Technologies

Infineon's CHL8212-02CRT is a 28-terminal switching controller with PWM control, operating at 1200 kHz. It features a buck switcher configuration for applications requiring a nominal input voltage of 3.3 V and can handle temperatures from 0 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,909 parts In-Stock

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8,909

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Digiode

USA . 785 parts In-Stock

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785

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Nova Conductors

Japan . 85 parts In-Stock

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85

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,517 parts In-Stock

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$5.500

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1,517

$5.500

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AZTECH Wire

Italy . 585 parts In-Stock

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$11.128

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585

$11.128

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Modulus Dynamics

Lithuania . 573 parts In-Stock

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$12.521

100+ parts

$12.020

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$11.519

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573

$12.521

$12.020

$11.519

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Microchip USA

USA . 7,336 parts In-Stock

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7,336

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Kepictronics

USA . 4,744 parts In-Stock

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4,744

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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A-Z Elektronik GmbH

Germany . 3,411 parts In-Stock

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3,411

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Corphita

USA . 541 parts In-Stock

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541

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Overview

Enhance the performance of your electronic devices with the CHL8212-02CRT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and reliability in their switching regulators and controllers. This versatile chip carrier features pulse width modulation control technique and a buck switcher configuration, making it perfect for a wide range of applications. With a nominal input voltage of 3.3V and a maximum switching frequency of 1200 kHz, this product offers unparalleled efficiency and precision. Upgrade your devices today and experience the benefits of Infineon's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and reliability for the package, ensuring the product lasts long and performs well under various conditions.

Surface Mount: YES

Surface mount capability makes it easier to integrate this switching regulator/controller into circuit boards, saving space and making the overall design more compact.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can operate safely in a wide range of environments without risking overheating or performance degradation.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for efficient regulation of the switching process, ensuring stable output voltage and current levels for the connected components.

Switcher Config: BUCK

Being configured as a buck converter means this product can efficiently step down input voltage to a lower output voltage, making it suitable for a wide range of applications requiring voltage regulation.

Technical Specifications

Switching Regulators & Controllers CHL8212-02CRT attributes and parameters. Explore more Switching Regulators & Controllers devices from Infineon Technologies

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

3.63 V

Minimum Input Voltage:

2.805 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PQCC-N28

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1200 kHz

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Trade Compliance

CHL8212-02CRT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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