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BSS84PE6433

Infineon Technologies

BSS84PE6433 by Infineon Technologies

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,746

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-

-

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VNN

France . 2,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

-

-

-

-

Digiode

USA . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

135

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-

-

-

Nova Conductors

Japan . 59 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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59

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 299 parts In-Stock

1+ parts

$4.100

100+ parts

$3.998

1k+ parts

$3.977

10k+ parts

-

299

$4.100

$3.998

$3.977

-

AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$9.722

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$9.722

-

-

-

Ampacity Inc.

Singapore . 1,120 parts In-Stock

1+ parts

$100.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

$100.100

-

-

-

Continental Prestige Electronics

USA . 5,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,481

-

-

-

-

Microchip USA

USA . 4,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,569

-

-

-

-

Bastille Electronics

Australia . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

600

-

-

-

-

Argo Parts USA

USA . 559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

559

-

-

-

-

Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

100+ parts

$16.980

1k+ parts

$16.980

10k+ parts

$16.980

300

-

$16.980

$16.980

$16.980

Corphita

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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125

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-

-

-

Technical Specifications

Additional Parts BSS84PE6433 attributes and parameters. Explore more Additional Parts devices from Infineon Technologies

Technical Specifications

Other Names:

SP000012323
BSS84P E6433-ND
BSS84PE6433
BSS84PE6433XT

Operating Temperature:

-55°C ~ 150°C (TJ)

Category:

Discrete Semiconductor Products
Transistors FETs, MOSFETs Single FETs, MOSFETs

FET Type:

P-Channel

Input Capacitance (Ciss) (Max) @ Vds:

19 pF @ 25 V

Gate Charge (Qg) (Max) @ Vgs:

1.5 nC @ 10 V

Mounting Type:

Surface Mount

Rds On (Max) @ Id, Vgs:

8Ohm @ 170mA, 10V

Supplier Device Package:

PG-SOT23

Vgs(th) (Max) @ Id:

2V @ 20µA

Standard Package:

10,000

Drain to Source Voltage (Vdss):

60 V

Power Dissipation (Max):

360mW (Ta)

Series:

SIPMOS®

Package / Case:

TO-236-3, SC-59, SOT-23-3

Technology:

MOSFET (Metal Oxide)

Current - Continuous Drain (Id) @ 25°C:

170mA (Ta)

Vgs (Max):

±20V

Drive Voltage (Max Rds On, Min Rds On):

4.5V, 10V

Package:

Tape & Reel (TR)

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

BSS84PE6433 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8541.21.0095

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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