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D01-9952042

Harwin PLC

D01-9952042 by Harwin PLC

Harwin PLC D01-9952042 is a SIP20 IC socket with 20 contacts, rated for 1A current. It has a housing made of POLYESTER, operates b/w -55 to 125 °C, and offers 1000VAC dielectric voltage. Suitable for wire wrap termination in chip carrier applications.

Median Price

$5.775

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

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Newark

USA . 40 parts In-Stock

1+ parts

$5.560

100+ parts

$4.040

1k+ parts

$3.360

10k+ parts

-

40

$5.560

$4.040

$3.360

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Mouser Electronics

USA . 296 parts In-Stock

1+ parts

$5.640

100+ parts

$4.060

1k+ parts

$3.470

10k+ parts

-

296

$5.640

$4.060

$3.470

-

DigiKey

USA . 305 parts In-Stock

1+ parts

$5.910

100+ parts

-

1k+ parts

$3.630

10k+ parts

-

305

$5.910

-

$3.630

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Element14

Singapore . 258 parts In-Stock

1+ parts

$6.310

100+ parts

-

1k+ parts

$3.664

10k+ parts

-

258

$6.310

-

$3.664

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 18 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Perfect Parts

USA . 802 parts In-Stock

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100+ parts

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1k+ parts

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10k+ parts

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802

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Corohmni

South Africa . 496 parts In-Stock

1+ parts

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496

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

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300

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Overview

Enhance your electronic projects with the D01-9952042 chip carrier IC socket by Harwin PLC. Crafted from high-quality materials, this socket offers reliable performance for your SIP20 devices. With a sleek design and easy wire wrap termination, it's ideal for various applications. Trust in Harwin PLC's reputation for excellence and choose the D01-9952042 for seamless integration, durability, and peace of mind. Elevate your projects with this top-of-the-line component today!

Feature Benefit Bullets

Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER

This material provides good mechanical strength and resistance to heat, making the chip carrier socket durable and reliable for long-term use.

Device Type Used On: SIP20

Designed specifically for SIP20 devices, ensuring a secure and precise fit for optimal performance.

Minimum Operating Temperature: -55 °C

Capable of operating in very low temperatures, making it suitable for a wide range of applications in different environments.

Termination Type: WIRE WRAP

Wire wrap termination provides a reliable connection for the IC socket, ensuring secure signal transmission and minimal signal loss.

Mating Contact Pitch (inch): 0.1

With a small pitch size, this chip carrier socket allows for high-density packaging of components, saving space and enabling compact designs.

Body Length: 2 inch

The 2-inch body length accommodates the SIP20 device securely, providing a stable base for installation and preventing movement or disconnection.

No. of Contacts: 20

With 20 contacts, this IC socket can accommodate the required connections for the SIP20 device, ensuring all signals are properly transmitted.

Insulation Resistance: 10000000000 ohm

High insulation resistance ensures minimal signal interference and prevents leakage, maintaining signal integrity and reliability.

Mounting Style: STRAIGHT

Straight mounting style facilitates easy installation and alignment, providing a secure and stable connection for the chip carrier socket.

Rating (Current): 1 A

Rated for a current of 1 A, this IC socket can support the power requirements of the SIP20 device without overheating or performance degradation.

Body Width: 0.1 inch

The slim 0.1-inch body width allows for compact and space-saving designs, ideal for applications with limited mounting space.

Dielectric Withstanding Voltage (V): 1000VAC

High dielectric voltage withstand capability ensures safety and reliability during operation, protecting the components and users from electrical hazards.

Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier

Tin contact finish with nickel barrier provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Body Depth: 0.193 inch

The 0.193-inch body depth allows for secure and stable insertion of the SIP20 device, preventing misalignment and ensuring proper contact with all connections.

IC Socket Type: IC SOCKET

Designed specifically for ICs, this IC socket provides a reliable and secure connection for the SIP20 device, ensuring proper signal transmission and performance.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperatures, making it suitable for a wide range of applications in different environments without performance degradation.

Technical Specifications

Chip Carrier IC & Component Sockets D01-9952042 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Harwin PLC

Connectivity

Number of Positions or Pins:

20

Contact Finish - Termination:

Tin with Nickel Barrier

Installation Type:

Wire Wrap

Mating Contact Pitch:

0.1 in (2.54 mm)

Mounting Style:

Physical Characteristics

IC Socket Type:

Length:

2 inch

Width:

0.1 in (2.54 mm)

Depth:

0.193 in (4.902 mm)

JESD-609 Code:

e3

Electrical Characteristics

Current Rating:

1 A

Dielectric Withstanding Voltage:

Insulation Resistance:

10 GΩ

Thermal Characteristics

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Compatibility

Compatible Device Type:

Additional Features

Special Features:

Standard: UL 94V-0

Trade Compliance

D01-9952042 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Manufacturer Highlights

Harwin PLC

Harwin is a world-leading specialist in reliable and high-performance technologies for demanding applications. Through innovation, advanced technologies, service and inspiration we help customers to realize competitive advantage by solving demanding connectivity challenges. Harwin aim to be the first-choice supplier of mission-critical and high-performance connectivity solutions. We keep investing in the latest computer aided design and engineering facilities to drive advancements and retain our position as the industry’s innovators. We also replace equipment on a five-year cycle.

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