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BZX85C4V3G

Eic Semiconductor

BZX85C4V3G by Eic Semiconductor

ZENER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Zener Diodes BZX85C4V3G attributes and parameters. Explore more Zener Diodes devices from Eic Semiconductor

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

13 ohm

Maximum Forward Voltage (VF):

1.2 V

JEDEC-95 Code:

DO-204AL

JESD-30 Code:

O-LALF-W2

Maximum Knee Impedance:

500 ohm

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1.3 W

Reference Standard:

TS 16949

Nominal Reference Voltage:

4.3 V

Maximum Reverse Current:

3 uA

Reverse Test Voltage:

1 V

Surface Mount:

NO

Technology:

ZENER

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Temperature Coefficient:

.43 mV/Cel

Maximum Voltage Tolerance:

5 %

Working Test Current:

50 mA

Trade Compliance

BZX85C4V3G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Eic Semiconductor

EIC is a major international manufacturer and supplier of discrete semiconductors. With over 15,000 parts and more than 50 package types, EIC offers one of the most comprehensive diode portfolios in the industry. The company’s products can be classified into five main categories: • Rectifier Diodes • High Speed Switching / Small Signal Diodes • Zener Diodes • Transient Voltage Suppressor Diodes • Transistors EIC provides end to end manufacturing with a dedicated wafer fab and assembly plant to ensure control of quality and supply. Expansion of the wafer fab during 2007 has provided EIC with the ability to supply products in die and wafer form, in addition to packaged parts. EIC provides its customers with world-class service and technical support, as well as high quality products at competitive prices. The company’s processes and procedures, from design to after sales service, are fully ISO 9001, ISO14001 and ISO/TS16949 certified, and all products are RoHs compliant. With sales offices worldwide, and a reliable logistics process, EIC is able to offer customers quick responses to both technical enquiries and product delivery. The EIC Engineering team is focused on developing superior discrete products to satisfy the variety of requirements from new customer systems. The company also offers an extensive capability for research and development of special purpose devices, to satisfy unique customer applications. These are achieved with close attention to cost reduction and fast time to market.

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