Loading...

SDM1L30BLP-13

Diodes Incorporated

SDM1L30BLP-13 by Diodes Incorporated

SDM1L30BLP-13 by Diodes Inc. is a bridge rectifier diode with a max output current of 1A and a min breakdown voltage of 30V. It is surface mountable and commonly used in automotive applications due to its AEC-Q101 reference standard and moisture sensitivity level of 1.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,312

-

-

-

-

Netsource Technology, Inc.

USA . 2,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,536

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 360 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$1.010

-

-

-

AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$10.264

100+ parts

-

1k+ parts

-

10k+ parts

-

198

$10.264

-

-

-

Lixinc

USA . 16,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,134

-

-

-

-

Kepictronics

USA . 6,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,927

-

-

-

-

Bastille Electronics

Australia . 134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

134

-

-

-

-

Overview

The SDM1L30BLP-13 by Diodes Incorporated is a high-quality bridge rectifier diode that offers numerous advantages. As a reputable manufacturer, Diodes Incorporated ensures superior performance and reliability in all their products. Bridge rectifier diodes are widely used in various applications, such as power supplies and battery chargers. The SDM1L30BLP-13, with its surface-mount design and chip carrier package style, provides convenience and ease of use. With a maximum output current of 1A and a minimum breakdown voltage of 30V, this diode delivers exceptional value and efficiency. Whether you're designing electronic circuits or building power systems, the SDM1L30BLP-13 is the perfect choice to meet your needs. Trust Diodes Incorporated for top-notch quality and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to high temperatures, making it suitable for various applications.

Config: BRIDGE, 4 ELEMENTS

The bridge configuration with four elements allows for efficient rectification and conversion of AC to DC power.

Surface Mount: YES

This surface mount feature enables easy installation on PCBs, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard PCB footprints, enhancing ease of integration into circuit designs.

No. of Terminals: 4

With four terminals, this bridge rectifier diode provides reliable connectivity and stability in electrical connections.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent heat dissipation and mechanical protection for reliable operation.

Maximum Operating Temperature: 150 °C

This high maximum operating temperature ensures the diode's performance and reliability even in demanding environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for reliable operation in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish offers excellent solderability and corrosion resistance, ensuring secure and long-lasting connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and ensures a compact design layout.

Minimum Breakdown Voltage: 30 V

The diode's minimum breakdown voltage of 30 V provides efficient voltage regulation and protection against voltage spikes.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this diode withstands soldering processes without compromising its functionality.

Peak Reflow Temperature °C: 260

The diode's peak reflow temperature of 260°C guarantees secure solder joints during PCB assembly.

Reference Standard: AEC-Q101

This diode complies with the AEC-Q101 automotive reliability standard, ensuring high-quality performance and long-term durability.

Diode Type: BRIDGE RECTIFIER DIODE

Being a bridge rectifier diode, it efficiently converts AC to DC power, suitable for a wide range of applications.

Maximum Output Current: 1 A

With a maximum output current of 1 A, this diode can handle various electrical loads efficiently.

Technology: SCHOTTKY

Utilizing Schottky technology, this diode offers low forward voltage drop and fast switching characteristics, suitable for high-speed applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for physical leads, reducing the overall size and improving thermal performance.

No. of Elements: 4

With four diode elements, this bridge rectifier diode provides efficient rectification and ensures balanced current distribution.

Maximum Repetitive Peak Reverse Voltage: 30 V

The diode's maximum repetitive peak reverse voltage of 30 V provides robust protection against reverse polarity.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this diode is suitable for various manufacturing and assembly processes, preventing moisture-related issues.

No. of Phases: 1

This single-phase diode is ideal for applications requiring rectification of single-phase AC power.

Maximum Non Repetitive Peak Forward Current: 50 A

The diode can handle high non-repetitive peak forward currents of up to 50 A, making it suitable for power surge protection.

Diode Element Material: SILICON

Made of silicon, this diode element material ensures high thermal conductivity and reliability, making it suitable for a wide range of applications.

Technical Specifications

Bridge Rectifier Diodes SDM1L30BLP-13 attributes and parameters. Explore more Bridge Rectifier Diodes devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Minimum Breakdown Voltage:

30 V

Config:

BRIDGE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

50 A

No. of Elements:

4

No. of Phases:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

30 V

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SDM1L30BLP-13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.