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PI5A3157BC6EX

Diodes Incorporated

PI5A3157BC6EX by Diodes Incorporated

PI5A3157BC6EX by Diodes Inc. is a SPDT switch with 30 ohm Ron, 63 dB isolation, and 1.8/5 V power supplies. It is a CMOS technology-based multiplexer suitable for industrial applications due to its -40 to 85 °C operating temperature range and small outline package style. The device features dual terminals in a rectangular plastic body ideal for surface mount assembly.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,296 parts In-Stock

1+ parts

$0.220

100+ parts

$0.115

1k+ parts

$0.105

10k+ parts

$0.087

5,296

$0.220

$0.115

$0.105

$0.087

DigiKey

USA . 2,780 parts In-Stock

1+ parts

$0.220

100+ parts

$0.114

1k+ parts

$0.095

10k+ parts

$0.100

2,780

$0.220

$0.114

$0.095

$0.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 303,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

303,483

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,303 parts In-Stock

1+ parts

$0.644

100+ parts

-

1k+ parts

-

10k+ parts

-

2,303

$0.644

-

-

-

Metaverse IC Inc.

Canada . 150,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,045

-

-

-

-

Authorized Procurement Solutions

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,000

-

-

-

-

iodParts Technologies Inc.

India . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,200

-

-

-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Lixinc

USA . 1,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

-

-

-

-

Overview

Enhance your electronic systems with the PI5A3157BC6EX by Diodes Incorporated, a leading manufacturer in the industry. This versatile multiplexer offers seamless switching capabilities and reliable performance, making it perfect for various applications. Experience the value of quality engineering with this product, providing customers with efficient functionality and enhanced productivity. Upgrade your projects with the PI5A3157BC6EX and discover the benefits of superior design and craftsmanship.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and resistant to damage, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 1.8 V

The low nominal supply voltage of 1.8V makes this product energy-efficient and suitable for applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions and ensures reliable performance in varying temperatures.

Technology: CMOS

The CMOS technology used in this product enables low power consumption and high noise immunity, making it a reliable choice for sensitive electronic circuits.

Nominal Off-state Isolation: 63 dB

With a high off-state isolation of 63 dB, the product ensures minimal signal interference and crosstalk, resulting in clear and reliable signal transmission.

Technical Specifications

Multiplexers & Switches PI5A3157BC6EX attributes and parameters. Explore more Multiplexers & Switches devices from Diodes Incorporated

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

63 dB

Nominal On-state Resistance Match:

.5 ohm

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

1.25 mm

Trade Compliance

PI5A3157BC6EX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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