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PI3DPX1203BZLEX

Diodes Incorporated

PI3DPX1203BZLEX by Diodes Incorporated

PI3DPX1203BZLEX by Diodes Inc. is a consumer IC with 32 terminals in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a terminal pitch of 0.4mm and very thin profile, it's ideal for compact electronic devices.

Median Price

$2.770

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,318 parts In-Stock

1+ parts

$1.910

100+ parts

$1.380

1k+ parts

$1.140

10k+ parts

$1.130

3,318

$1.910

$1.380

$1.140

$1.130

DigiKey

USA . 35,309 parts In-Stock

1+ parts

$3.630

100+ parts

$1.597

1k+ parts

$1.194

10k+ parts

$1.137

35,309

$3.630

$1.597

$1.194

$1.137

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

70,000

-

-

-

-

Overview

Elevate your consumer electronics experience with the PI3DPX1203BZLEX by Diodes Incorporated. Known for their top-notch quality and cutting-edge technology, Diodes Incorporated offers a wide range of innovative solutions for various applications in the consumer electronics industry. This product, belonging to the Other Function Consumer ICs category, boasts unparalleled value, benefits, and advantages for customers seeking high-performance and reliable components. With its surface mount capability, compact package shape, and wide operating temperature range, the PI3DPX1203BZLEX is perfect for demanding industrial environments where space and efficiency are crucial. Experience the difference with Diodes Incorporated and take your projects to the next level with this exceptional product.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and reducing the overall size of the final product.

No. of Terminals: 32

Having 32 terminals provides versatility and flexibility in connecting the IC to various components within a circuit, allowing for complex functionality and interactivity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the IC can withstand and operate effectively in demanding environmental conditions, making it reliable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C further enhances the versatility of the IC, allowing it to function in a wide range of temperature environments without compromising performance.

Width: 3 mm

With a compact width of 3 mm, the IC can be easily integrated into space-constrained designs, making it suitable for applications where size is a critical factor.

Length: 6 mm

The moderate length of 6 mm strikes a balance between compactness and functionality, allowing the IC to accommodate a sufficient number of terminals without sacrificing the overall size of the product.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3 V ensures energy efficiency and compatibility with a wide range of power sources, making the IC suitable for battery-operated devices.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides a safe operating range for the IC, ensuring stable performance without risking damage due to voltage fluctuations.

Technical Specifications

Other Function Consumer ICs PI3DPX1203BZLEX attributes and parameters. Explore more Other Function Consumer ICs devices from Diodes Incorporated

Specs

General IC Type:

JESD-30 Code:

R-XQCC-N32

Length:

6 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

PI3DPX1203BZLEX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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