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FX2500059

Diodes Incorporated

FX2500059 by Diodes Incorporated

Diodes Inc. FX2500059 is a 25 MHz crystal oscillator with aging of 3 PPM/yr. It features surface mounting and drive level of 10 uW. Ideal for applications requiring precise timing in compact spaces.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$0.502

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100

$0.502

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Vyrian

USA . 5,567 parts In-Stock

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5,567

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Prism Electronics

USA . 52 parts In-Stock

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,644 parts In-Stock

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$2.010

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1,644

$2.010

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AZTECH Wire

Italy . 213 parts In-Stock

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$9.663

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213

$9.663

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Netroflash

USA . 100 parts In-Stock

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100+ parts

$0.492

1k+ parts

$0.477

10k+ parts

$0.467

100

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$0.492

$0.477

$0.467

Perfect Parts

USA . 58 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the FX2500059 crystal oscillator from Diodes Incorporated. Known for their superior quality and reliability, Diodes Incorporated delivers cutting-edge technology in the field of crystal oscillators. Perfect for a wide range of applications, this parallel-fundamental type oscillator operates at 25 MHz with minimal aging of only 3 PPM in the first year. With surface mounting feature and low drive level, this compact oscillator offers high precision and stability for your devices. Upgrade your electronics with the FX2500059 and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Crystal or Resonator Type: PARALLEL - FUNDAMENTAL

This type of crystal oscillator offers stability and precision in frequency generation, making it a reliable choice for various applications.

Nominal Operating Frequency: 25 MHz

The operating frequency of 25 MHz is suitable for many electronic devices and systems, providing a common and widely used frequency reference.

Aging: 3 PPM/FIRST YEAR

With low aging rate of 3 parts per million per year, this crystal oscillator maintains its frequency accuracy over extended periods, ensuring consistent performance.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for easy and compact installation on PCBs, saving space and simplifying the overall design of electronic circuits.

Drive Level: 10 uW

The low drive level requirement of 10 micro watts reduces power consumption and minimizes heat generation, making this crystal oscillator energy-efficient.

Physical Dimension: L6.0XB3.5XH1.1 (mm)/L0.236XB0.138XH0.043 (inch)

Compact dimensions of 6.0 x 3.5 x 1.1 mm (0.236 x 0.138 x 0.043 inch) enable easy integration into small electronic devices or crowded PCB layouts.

Technical Specifications

Crystal Oscillators FX2500059 attributes and parameters. Explore more Crystal Oscillators devices from Diodes Incorporated

Specs

Additional Features:

AT-CUT; TR

Crystal or Resonator Type:

Drive Level:

10 uW

Mounting Feature:

Nominal Operating Frequency:

25 MHz

Physical Dimension:

L6.0XB3.5XH1.1 (mm)/L0.236XB0.138XH0.043 (inch)

Trade Compliance

FX2500059 Crystals & Resonators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.60.00.60

SB

8541.60.00.60

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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