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B330AF-13

Diodes Incorporated

B330AF-13 by Diodes Incorporated

B330AF-13 by Diodes Inc. is a Schottky rectifier diode with max output current of 3A and max repetitive peak reverse voltage of 30V. It's a surface mount device in small outline package, ideal for efficiency applications at -55°C operating temp.

Median Price

$0.133

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 57,496 parts In-Stock

1+ parts

$0.260

100+ parts

$0.115

1k+ parts

$0.071

10k+ parts

$0.050

57,496

$0.260

$0.115

$0.071

$0.050

Mouser Electronics

USA . 13,713 parts In-Stock

1+ parts

$0.260

100+ parts

$0.116

1k+ parts

$0.068

10k+ parts

$0.049

13,713

$0.260

$0.116

$0.068

$0.049

Newark

USA . 7,392 parts In-Stock

1+ parts

$0.265

100+ parts

$0.120

1k+ parts

$0.075

10k+ parts

-

7,392

$0.265

$0.120

$0.075

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.050

10,000

-

-

-

$0.050

Farnell

UK . 9,455 parts In-Stock

1+ parts

-

100+ parts

$0.133

1k+ parts

$0.076

10k+ parts

$0.074

9,455

-

$0.133

$0.076

$0.074

Element14

Singapore . 9,455 parts In-Stock

1+ parts

-

100+ parts

$0.093

1k+ parts

$0.069

10k+ parts

$0.066

9,455

-

$0.093

$0.069

$0.066

RS (Exports)

UK . 9,300 parts In-Stock

1+ parts

-

100+ parts

$0.126

1k+ parts

$0.099

10k+ parts

$0.073

9,300

-

$0.126

$0.099

$0.073

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 80,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.058

80,000

-

-

-

$0.058

ComSIT Distribution GmbH

Germany . 26,963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,963

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 9,730 parts In-Stock

1+ parts

$0.400

100+ parts

$0.148

1k+ parts

$0.065

10k+ parts

$0.048

9,730

$0.400

$0.148

$0.065

$0.048

Eastek

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.069

20,000

-

-

-

$0.069

GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Northwest PG Solutions

USA . 1,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.940

10k+ parts

-

1,722

-

-

$3.940

-

Native Components

USA . 455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.899

10k+ parts

-

455

-

-

$3.899

-

Overview

Experience unparalleled efficiency and reliability with the B330AF-13 from Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated ensures top-notch quality and performance in their diodes and rectifiers. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. Say goodbye to inefficiency and hello to seamless operation with the B330AF-13.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the diode, making it suitable for various environments.

Config: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design.

Surface Mount: YES

Surface mount capability allows for space-saving and efficient PCB layout.

Maximum Reverse Current: 200 uA

Low reverse current ensures minimal power loss and efficient operation.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy handling and placement during assembly.

No. of Terminals: 2

Having only two terminals simplifies the connection process.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB.

Application: EFFICIENCY

Designed for efficiency-focused applications, ensuring optimal performance.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for use in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit connections.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time aids in fast and efficient assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints.

Diode Type: RECTIFIER DIODE

Rectifier diode type is suitable for converting AC to DC current with low voltage drop.

Maximum Forward Voltage (VF): 0.5 V

Low forward voltage drop helps in minimizing power losses.

Maximum Output Current: 3 A

High output current capability allows for handling higher loads.

Technology: SCHOTTKY

Schottky technology provides fast switching and low forward voltage drop.

Terminal Form: FLAT

Flat terminal form ensures easy and secure connections.

Maximum Repetitive Peak Reverse Voltage: 30 V

Suitable for applications requiring handling of up to 30V reverse voltage.

Maximum Non Repetitive Peak Forward Current: 80 A

High peak forward current rating allows for handling surge currents.

Diode Element Material: SILICON

Silicon diode element material offers high reliability and performance.

Technical Specifications

Diodes & Rectifiers B330AF-13 attributes and parameters. Explore more Diodes & Rectifiers devices from Diodes Incorporated

Specs

Application:

EFFICIENCY

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.5 V

JEDEC-95 Code:

DO-214AC

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

80 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Current:

200 uA

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

B330AF-13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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