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AP8800FNG-7

Diodes Incorporated

AP8800FNG-7 by Diodes Incorporated

AP8800FNG-7 by Diodes Inc. is a switching regulator with a small outline, heat sink/slug, and very thin profile package style. It operates in an industrial temperature range of -40 to 85°C and has a max switching frequency of 600 kHz. This IC is commonly used for voltage regulation in various applications.

Median Price

$0.529

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.529

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650

$0.529

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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VNN

France . 2,003 parts In-Stock

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2,003

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Vyrian

USA . 1,020 parts In-Stock

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1,020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.529

100+ parts

-

1k+ parts

$0.503

10k+ parts

$0.492

500

$0.529

-

$0.503

$0.492

Ampacity Inc.

Singapore . 564 parts In-Stock

1+ parts

$2.500

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564

$2.500

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AZTECH Wire

Italy . 233 parts In-Stock

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$14.529

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233

$14.529

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Perfect Parts

USA . 63,403 parts In-Stock

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63,403

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Lixinc

USA . 5,658 parts In-Stock

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5,658

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

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100+ parts

$4.360

1k+ parts

$4.037

10k+ parts

$4.037

500

-

$4.360

$4.037

$4.037

Overview

Discover the AP8800FNG-7, a high-quality switching regulator and controller crafted by the trusted manufacturer Diodes Incorporated. This innovative product boasts numerous advantages, including its compact square design, surface mount capability, and impressive temperature range from -40 to 85°C. With its pulse width modulation control technique and buck switcher configuration, this device offers unparalleled precision and efficiency. Ideal for industrial applications, the AP8800FNG-7 guarantees reliable performance and optimal power management. Unlock new possibilities with Diodes Incorporated's cutting-edge technology and experience the value, benefits, and advantages that this exceptional product brings to your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material is optimal for the package body because it provides durability and protection, making the product reliable for various applications.

Surface Mount:

YES. The surface mount feature allows for easy installation and integration of the switching regulator, saving valuable space on a circuit board.

No. of Functions:

1. With a single function, this switching regulator simplifies circuit design and implementation, ensuring efficient power conversion.

Package Shape:

SQUARE. The square shape of the package provides stability and ease of mounting, ensuring a secure fit on the circuit board.

No. of Terminals:

10. The presence of multiple terminals allows for versatile connectivity options, enabling the switching regulator to be seamlessly integrated into various designs.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE. This package style ensures efficient dissipation of heat and a slim profile, making it suitable for compact applications where space is limited.

Maximum Operating Temperature:

85 °C. With a high maximum operating temperature, this switching regulator can withstand demanding conditions, making it reliable for industrial applications.

Minimum Operating Temperature:

40 °C. The ability to operate at low temperatures allows this switching regulator to perform well in environments with colder conditions, expanding its usability.

Terminal Finish:

NICKEL PALLADIUM GOLD. The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and extended product lifespan.

Terminal Position:

DUAL. The dual terminal position enhances flexibility in circuit board layouts and integration, enabling the switching regulator to be positioned optimally within the design.

Maximum Seated Height:

0.6 mm. The extremely low seated height of this switching regulator saves space and allows for seamless integration in compact devices and slim designs.

Width (mm):

3 mm. The compact width of the switching regulator enables it to fit into narrow spaces, contributing to highly efficient designs.

Other IC type:

SWITCHING REGULATOR. This specific type of IC promotes efficient energy conversion and offers high power density, making it a reliable choice for power management applications.

Nominal Input Voltage:

12 V. The nominal input voltage of 12 V makes this switching regulator compatible with a wide range of power supplies, enhancing its versatility in different applications.

Maximum Time At Peak Reflow Temperature (s):

30. The ability to withstand the peak reflow temperature for 30 seconds ensures the switching regulator can endure the soldering process, guaranteeing reliable connections during assembly.

Peak Reflow Temperature °C:

260. The peak reflow temperature of 260 C ensures proper solder melting and joint formation during the manufacturing process, resulting in secure electrical connections.

Length:

3 mm. With its compact length, this switching regulator is suitable for applications where space is at a premium, providing design flexibility and compact form factors.

Temperature Grade:

INDUSTRIAL. Designed for industrial applications, this switching regulator can operate reliably in demanding temperature environments, ensuring consistent performance.

Maximum Switching Frequency:

600 kHz. The high switching frequency offers fast response and efficient power conversion, making this switching regulator suitable for high-performance applications.

Terminal Form:

NO LEAD. The no-lead terminal form ensures efficient soldering and compatibility with lead-free assembly processes, contributing to environmentally-friendly practices.

Control Technique:

PULSE WIDTH MODULATION. The pulse width modulation control technique allows precise regulation of the output voltage, offering stable and accurate power conversion in a wide range of applications.

Switcher Config:

BUCK. The buck configuration of this switching regulator provides step-down voltage conversion, making it ideal for applications that require lower output voltage than the input.

Terminal Pitch:

0.5 mm. The small terminal pitch allows for compact designs and high-density circuit boards, maximizing integration possibilities and saving space.

Moisture Sensitivity Level (MSL):

1. The moisture sensitivity level of 1 ensures that the switching regulator can withstand exposure to ambient moisture during storage or assembly, ensuring product reliability.

Minimum Input Voltage:

8 V. With its ability to operate at a low minimum input voltage, this switching regulator can be used in applications that require efficient power conversion from low-voltage sources.

Maximum Input Voltage:

28 V. The high maximum input voltage capability allows this switching regulator to handle a wide range of power sources, providing versatility and compatibility in various applications.

Technical Specifications

Switching Regulators & Controllers AP8800FNG-7 attributes and parameters. Explore more Switching Regulators & Controllers devices from Diodes Incorporated

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

600 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

AP8800FNG-7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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