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AP65403SP-13

Diodes Incorporated

AP65403SP-13 by Diodes Incorporated

SWITCHING REGULATOR; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HLSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$6.163

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 8 parts In-Stock

1+ parts

$6.163

100+ parts

$5.544

1k+ parts

$5.235

10k+ parts

$4.627

8

$6.163

$5.544

$5.235

$4.627

Vyrian

USA . 2,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,013 parts In-Stock

1+ parts

$3.427

100+ parts

-

1k+ parts

-

10k+ parts

-

1,013

$3.427

-

-

-

AZTECH Wire

Italy . 56 parts In-Stock

1+ parts

$20.080

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$20.080

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24,913

-

-

-

-

Metaverse IC Inc.

Canada . 1,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,898

-

-

-

-

Native Components

USA . 671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.022

10k+ parts

-

671

-

-

$3.022

-

Microchip USA

USA . 164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

164

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-

-

-

Technical Specifications

Switching Regulators & Controllers AP65403SP-13 attributes and parameters. Explore more Switching Regulators & Controllers devices from Diodes Incorporated

Specs

Additional Features:

OUTPUT VOLTAGE RANGE FROM 2.5 V TO 12 V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

17 V

Minimum Input Voltage:

4.75 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

750 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

AP65403SP-13 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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