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SC14CVMDECTSF01T

Dialog Semiconductor

SC14CVMDECTSF01T by Dialog Semiconductor

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 88; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Cordless Phone ICs SC14CVMDECTSF01T attributes and parameters. Explore more Cordless Phone ICs devices from Dialog Semiconductor

Specs

JESD-30 Code:

R-XXMA-N88

Length:

19.6 mm

No. of Functions:

1

No. of Terminals:

88

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18 mm

Trade Compliance

SC14CVMDECTSF01T Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Dialog Semiconductor

TOKYO, Japan, August 31, 2021 JST | LONDON, United Kingdom, August 31, 2021 ― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Dialog Semiconductor Plc (“Dialog”), a leading provider of battery and power management, Wi-Fi, Bluetooth® low energy and Industrial edge computing solutions, today announced the successful completion of Renesas’ acquisition of the entire issued and to be issued share capital of Dialog. Renesas will fund the cash consideration payable to Dialog shareholders of approximately EUR 4.8 billion (approximately 624.0 billion yen at an exchange rate of 130 yen to the Euro) through a combination of debt, cash on hand and the proceeds of an equity offering of approximately 222.6 billion yen.

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