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PSP-1002

Broadcom

PSP-1002 by Broadcom

SPLITTER AND COMBINER; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel; Maximum Insertion Loss: 1 dB; Maximum Voltage Standing Wave Ratio: 1.7; Maximum Operating Frequency: 10000 MHz;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 335 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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335

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Digiode

USA . 294 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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294

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Decca Corp

Germany . 1,337 parts In-Stock

1+ parts

$24.000

100+ parts

$23.520

1k+ parts

$23.285

10k+ parts

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1,337

$24.000

$23.520

$23.285

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Supply Digital

USA . 2,049 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,049

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Corphita

USA . 432 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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432

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Technical Specifications

RF/Microwave Splitter/Combiners PSP-1002 attributes and parameters. Explore more RF/Microwave Splitter/Combiners devices from Broadcom

Specs

Characteristic Impedance:

50 ohm

Construction:

MODULE

Maximum Input Power (CW):

30 dBm

Maximum Insertion Loss:

1 dB

Maximum Operating Frequency:

10000 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

RF or Microwave Device Type:

Maximum Voltage Standing Wave Ratio:

1.7

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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