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HSM9-C380

Broadcom

HSM9-C380 by Broadcom

INFRARED LED; Mounting Feature: SURFACE MOUNT; Maximum Forward Voltage: 1.5 V; Packing Method: TR, 7 INCH; Maximum Forward Current: .07 A; Shape: ROUND;

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 4,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 4,000 parts In-Stock

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Distributors (In-Stock)

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Vyrian

USA . 362 parts In-Stock

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$0.320

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362

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Bristol Electronics

USA . 19,992 parts In-Stock

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Dan-Mar Components

USA . 19,992 parts In-Stock

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Flip Electronics

USA . 4,000 parts In-Stock

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Digiode

USA . 326 parts In-Stock

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326

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,963 parts In-Stock

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$0.272

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Decca Corp

Germany . 3,719 parts In-Stock

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$0.267

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$0.264

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3,719

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Supply Digital

USA . 2,780 parts In-Stock

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Corphita

USA . 398 parts In-Stock

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Technical Specifications

Infrared LEDs HSM9-C380 attributes and parameters. Explore more Infrared LEDs devices from Broadcom

Specs

Configuration:

SINGLE

Maximum Forward Current:

.07 A

Maximum Forward Voltage:

1.5 V

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 7 INCH

Peak Wavelength (nm):

940

Shape:

ROUND

Size:

1.4 mm

Viewing Angle:

20 deg

Trade Compliance

HSM9-C380 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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