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HDSP-H1A1

Broadcom

HDSP-H1A1 by Broadcom

7 SEG NUMERIC LED DISPLAY; Nominal Luminous Intensity (mcd): 70.0; Terminal Finish: Tin (Sn); Peak Wavelength (nm): 644; Display Height: 25.4 mm; JESD-609 Code: e3;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 140 parts In-Stock

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Vyrian

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135

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AZTECH Wire

Italy . 736 parts In-Stock

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$13.940

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736

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Ampacity Inc.

Singapore . 1,275 parts In-Stock

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$16.100

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Decca Corp

Germany . 464 parts In-Stock

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$17.000

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$16.660

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$16.493

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464

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Component Stockers USA

USA . 3,757 parts In-Stock

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$19.990

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Supply Digital

USA . 2,238 parts In-Stock

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Northwest PG Solutions

USA . 1,045 parts In-Stock

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Corphita

USA . 215 parts In-Stock

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Native Components

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Technical Specifications

LED Displays HDSP-H1A1 attributes and parameters. Explore more LED Displays devices from Broadcom

Specs

Additional Features:

HIGH RELIABILITY

Color:

DEEP RED

Color At Wavelength:

Orange-Red

Configuration:

COMMON ANODE, 1 DIGIT WITH DECIMAL POINT

Display Height:

25.4 mm

Maximum Forward Current:

.02 A

Maximum Forward Voltage:

5.2 V

JESD-609 Code:

e3

Nominal Luminous Intensity (mcd):

No. of Characters:

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Peak Wavelength (nm):

644

Terminal Finish:

Trade Compliance

HDSP-H1A1 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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