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HCPL-7710-520

Broadcom

HCPL-7710-520 by Broadcom

LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Additional Features: UL RECOGNIZED; Maximum On State Current: .01 A; Maximum Isolation Voltage: 3750 V;

Median Price

$0.154

Lifecycle Status

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3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

USA . 2,958 parts In-Stock

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Digiode

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Native Components

USA . 642 parts In-Stock

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$0.105

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Northwest PG Solutions

USA . 2,002 parts In-Stock

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$0.115

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Decca Corp

Germany . 312 parts In-Stock

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$15.000

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$14.700

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$14.553

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AZTECH Wire

Italy . 1,139 parts In-Stock

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Glotronic Ltd.

UK . 4,100 parts In-Stock

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Corphita

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Supply Digital

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Technical Specifications

Optocoupler Circuit Outputs HCPL-7710-520 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Broadcom

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Nominal Data Rate:

12 MBps

Maximum Forward Current:

.01 A

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e0

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.01 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Response Time:

.001 s

Sub-Category:

Optocoupler - Transistor Outputs

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

HCPL-7710-520 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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