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AMMP-6125-TR1G

Broadcom

AMMP-6125-TR1G by Broadcom

FREQUENCY DOUBLER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Characteristic Impedance: 50 ohm; Construction: COMPONENT;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 272 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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210

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Distributors (Availability)

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Ampacity Inc.

Singapore . 241 parts In-Stock

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$1.000

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241

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Decca Corp

Germany . 578 parts In-Stock

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$12.000

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$11.760

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$11.642

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578

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AZTECH Wire

Italy . 1,067 parts In-Stock

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$16.490

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$16.490

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Corphita

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484

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Supply Digital

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Northwest PG Solutions

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Native Components

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Technical Specifications

RF/Microwave Frequency Multipliers AMMP-6125-TR1G attributes and parameters. Explore more RF/Microwave Frequency Multipliers devices from Broadcom

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

10 dBm

Mounting Feature:

No. of Terminals:

8

Maximum Operating Frequency:

24000 MHz

Minimum Operating Frequency:

10000 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC8,.2SQ,28

Power Supplies (V):

3.5/5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Frequency Multipliers

Trade Compliance

AMMP-6125-TR1G RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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