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AP3030KTR-E1

Bcd Semiconductor Manufacturing

AP3030KTR-E1 by Bcd Semiconductor Manufacturing

LED DISPLAY DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 89 parts In-Stock

1+ parts

$413.710

100+ parts

$405.436

1k+ parts

$401.299

10k+ parts

$397.162

89

$413.710

$405.436

$401.299

$397.162

Northwest PG Solutions

USA . 1,976 parts In-Stock

1+ parts

$455.081

100+ parts

-

1k+ parts

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10k+ parts

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1,976

$455.081

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-

-

Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,800

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Microchip USA

USA . 494 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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494

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Technical Specifications

Graphics Display Drivers AP3030KTR-E1 attributes and parameters. Explore more Graphics Display Drivers devices from Bcd Semiconductor Manufacturing

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

Length:

2.92 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

AP3030KTR-E1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Bcd Semiconductor Manufacturing

Diodes Incorporated to Acquire BCD Semiconductor Manufacturing Limited December 26, 2012 | Plano, Texas Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, and BCD Semiconductor Manufacturing Limited ("BCD Semiconductor" or "BCD") (Nasdaq: BCDS), a leading analog integrated device manufacturer incorporated in the Cayman Islands, today announced that Diodes has entered into an Agreement and Plan of Merger to acquire BCD. BCD Semiconductor Manufacturing Limited (BCD Semi) is a leading analog integrated device manufacturer, or IDM, based in Greater China, specializing in the design, manufacture and sale of power management integrated circuits, or ICs. The company's broad portfolio of power management ICs primarily targets rapidly growing, high volume markets such as mobile phones, portable media players, LCD televisions and monitors, personal computers, adapters and chargers and other electronics products. As an IDM, BCD Semi integrates product design and process technology to optimize product performance and cost. The company offers system-level solutions with the quality, performance and reliability required by our customers. Our Greater China-based operations provide proximity to the rapidly growing electronics industry in Asia, enabling us to align our product development effort with customers and market trends and to provide timely and effective technical support to its customers.

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