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ZLR32300H2032X

Analog Devices

ZLR32300H2032X by Analog Devices

ZLR32300H2032X by Analog Devices is an 8-bit microcontroller with a clock frequency of 8 MHz, suitable for commercial applications. It operates b/w 0-70 °C, has 16 I/O lines, and a supply voltage range of 2-3.6 V. The package style is small outline with dual terminals in a rectangular shape, making it ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,263 parts In-Stock

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Digiode

USA . 2,222 parts In-Stock

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Anansix

USA . 180 parts In-Stock

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One Stop Electronics

USA . 2,526 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 298 parts In-Stock

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$5.459

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Semicontronic

India . 263 parts In-Stock

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$12.000

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$11.700

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$11.640

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263

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MARBEL Systems

Belgium . 5,824 parts In-Stock

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$57.279

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$54.988

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Texas Native Microelectronics

USA . 1,414 parts In-Stock

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$65.838

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$63.204

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$61.229

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Kenton Components

USA . 15,379 parts In-Stock

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$79.006

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$69.525

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Corphita

USA . 3,029 parts In-Stock

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Qasali Group International

UK . 106 parts In-Stock

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$170.652

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$156.431

Overview

Unlock the potential of your electronics projects with the ZLR32300H2032X microcontroller by Analog Devices. Designed with precision and reliability in mind, this small yet powerful device offers endless possibilities for applications in various industries. From smart home devices to industrial automation, this microcontroller delivers unmatched performance and efficiency. With a wide range of features and a reputable manufacturer like Analog Devices behind it, the ZLR32300H2032X guarantees top-notch quality and durability. Upgrade your projects today and experience the difference with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easier assembly and compact design, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability allows the product to handle a wide range of power input scenarios without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient placement on circuit boards, optimizing space utilization and enhancing overall system design.

Bit Size: 8

With an 8-bit size, the product is capable of processing data in smaller chunks, making it suitable for applications that do not require extensive data processing capabilities.

No. of Terminals: 20

Having 20 terminals provides adequate connectivity options for interfacing with external components, enabling greater versatility in system integration.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement allows the product to operate efficiently even in low-power scenarios, making it energy-efficient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliable performance in varying environmental conditions, enhancing product durability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature threshold enables the product to function reliably in cold environments without compromising performance.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish provides good solderability and corrosion resistance, ensuring robust electrical connections.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in circuit board layout, facilitating efficient routing of traces and reducing signal interference.

Maximum Seated Height: 1.99 mm

The low maximum seated height profile makes the product suitable for compact designs and height-restricted applications.

Width: 5.29 mm

The compact width dimension allows for efficient space utilization on the circuit board, contributing to overall system miniaturization.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency capability enables fast data processing and response times, making the product suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The product's quick reflow temperature handling capability ensures efficient soldering processes, reducing assembly time and costs.

Peak Reflow Temperature °C: 225

The high peak reflow temperature tolerance allows for reliable solder joint formation during assembly, ensuring robust mechanical connections.

Length: 7.2 mm

The compact length dimension contributes to overall space-saving design, especially in applications where board real estate is limited.

Temperature Grade: COMMERCIAL

Being designated as a commercial-grade product indicates that it meets standard performance requirements for general commercial applications.

Peripheral IC Type: MICROCONTROLLER

The product being a microcontroller offers integrated peripheral functionalities, simplifying system design and reducing external component count.

Technology: CMOS

The CMOS technology utilized in the product ensures low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form factor offers secure mechanical connections and ease of soldering during assembly, ensuring reliable electrical contacts.

ROM Programmability: MROM

With Mask ROM (MROM) programmability, the product provides secure and permanent storage of firmware or code, ensuring data integrity and protection against unauthorized modifications.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for high-density mounting and compact layout on circuit boards, enabling efficient use of available space.

Speed: 8 rpm

The speed rating of 8 rpm indicates the product's capability to execute instructions quickly, making it suitable for responsive and time-critical applications.

No. of I/O Lines: 16

Having 16 Input/Output (I/O) lines offers sufficient interfacing options for connecting external devices and sensors, enhancing the product's overall connectivity.

Technical Specifications

Microcontrollers ZLR32300H2032X attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

7.2 mm

No. of I/O Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

225

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

1.99 mm

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.29 mm

Peripheral IC Type:

Trade Compliance

ZLR32300H2032X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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