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MAX14500AEWN+

Analog Devices

MAX14500AEWN+ by Analog Devices

MAX14500AEWN+ by Analog Devices is a consumer IC with 56 terminals, operating temperature range of -40 to 85 °C. It features CMOS technology, package style GRID ARRAY, and is suitable for industrial applications requiring supply voltage b/w 2.1V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,915 parts In-Stock

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5,915

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Digiode

USA . 2,224 parts In-Stock

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2,224

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Anansix

USA . 1,541 parts In-Stock

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1,541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 1,956 parts In-Stock

1+ parts

$0.756

100+ parts

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1,956

$0.756

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Texas Native Microelectronics

USA . 218 parts In-Stock

1+ parts

$0.869

100+ parts

$0.834

1k+ parts

$0.808

10k+ parts

$0.765

218

$0.869

$0.834

$0.808

$0.765

Kenton Components

USA . 4,220 parts In-Stock

1+ parts

$1.043

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$0.918

4,220

$1.043

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$0.918

Qasali Group International

UK . 2,023 parts In-Stock

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$2.346

100+ parts

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$2.182

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$2.065

2,023

$2.346

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$2.182

$2.065

One Stop Electronics

USA . 1,322 parts In-Stock

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$2.800

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1,322

$2.800

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AZTECH Wire

Italy . 819 parts In-Stock

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$6.183

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819

$6.183

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Semicontronic

India . 1,318 parts In-Stock

1+ parts

$9.800

100+ parts

$9.555

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$9.506

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1,318

$9.800

$9.555

$9.506

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Corphita

USA . 2,630 parts In-Stock

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2,630

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Overview

Unlock the power of innovation with Analog Devices' MAX14500AEWN+. This cutting-edge consumer IC offers unmatched quality and reliability, making it a top choice for a wide range of applications. From industrial automation to consumer electronics, this versatile product delivers exceptional performance and efficiency. Experience the difference with Analog Devices - where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape provides compatibility with standard PCB layouts and allows for efficient use of space on the board.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in everyday electronic devices.

No. of Terminals: 56

A high number of terminals provide flexibility for connecting to various components and interfaces, enhancing the functionality of the IC.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch allows for high-density mounting, enabling compact and space-saving designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function in cold environments or during temperature fluctuations, increasing its versatility.

Terminal Position: BOTTOM

The bottom terminal position simplifies the soldering process during assembly and provides a more secure connection to the PCB.

Maximum Seated Height: 0.69 mm

The low seated height enables thin and compact designs, ideal for slim electronic devices or applications with space constraints.

Width: 3.56 mm

The narrow width of the package allows for efficient use of board space and contributes to a compact overall design.

Minimum Supply Voltage (Vsup): 2.1 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources and helps in optimizing power consumption.

Length: 4.06 mm

The compact length of the package contributes to a small footprint on the PCB, allowing for more compact and space-efficient designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the IC suitable for battery-powered and noise-sensitive applications.

Terminal Form: BALL

The ball terminal form facilitates easy and reliable mounting on the PCB, ensuring a strong connection for stable operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and precise connection to other components, enabling compact and efficient board layouts.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage capability provides flexibility in power supply options and ensures compatibility with a wide range of voltage sources.

Technical Specifications

Other Function Consumer ICs MAX14500AEWN+ attributes and parameters. Explore more Other Function Consumer ICs devices from Analog Devices

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B56

Length:

4.06 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.69 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.56 mm

Trade Compliance

MAX14500AEWN+ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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