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HMC558LC3BRTR

Analog Devices

HMC558LC3BRTR by Analog Devices

Analog Devices' HMC558LC3BRTR is a GAAS RF/Microwave Mixer with 12 terminals. It operates b/w -40°C to 85°C, featuring a ceramic package for surface mount applications. Ideal for high-frequency signal processing in communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,075 parts In-Stock

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4,075

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Digiode

USA . 740 parts In-Stock

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740

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Distributors (Availability)

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Parana Technologies

USA . 1,933 parts In-Stock

1+ parts

$2.695

100+ parts

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$2.506

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1,933

$2.695

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$2.506

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IDEA Electronic Components Group

UK . 1,815 parts In-Stock

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$2.898

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$2.753

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$2.898

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$2.753

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DigiPath Technology Company

USA . 2,294 parts In-Stock

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$4.521

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$4.340

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2,294

$4.521

$4.340

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AZTECH Wire

Italy . 303 parts In-Stock

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$10.148

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303

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One Stop Electronics

USA . 1,182 parts In-Stock

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$12.000

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1,182

$12.000

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Semicontronic

India . 892 parts In-Stock

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$38.000

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$37.050

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$36.860

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892

$38.000

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Corphita

USA . 277 parts In-Stock

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Overview

Elevate your RF/Microwave applications with the HMC558LC3BRTR mixer from Analog Devices. Renowned for their superior quality and cutting-edge technology, Analog Devices delivers unmatched performance in a compact ceramic package. With a wide operating temperature range and surface mount feature, this GAAS-based mixer is perfect for various industries. Experience seamless integration, improved efficiency, and reliable performance with the HMC558LC3BRTR, setting a new standard in RF/Microwave mixers. Upgrade your systems today and unlock endless possibilities with Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal properties, ensuring stable operation even at high temperatures. It also offers good resistance to moisture and provides better reliability.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options and potential signal routing, making the mixer suitable for a variety of RF/microwave applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures enables the mixer to be used in demanding environments without risking overheating or degradation of performance.

Minimum Operating Temperature: -40 °C

The mixer can also operate at low temperatures, making it suitable for a wide range of operating conditions and ensuring consistent performance in various environments.

Technology: GAAS

Gallium Arsenide (GaAs) technology offers high-frequency performance, low noise figure, and good linearity, making it ideal for RF/microwave mixers that require high signal integrity and minimal distortion.

Mounting Feature: SURFACE MOUNT

Surface mount technology eases the installation process, reduces footprint, and enhances thermal conductivity, making the mixer a compact and reliable solution for RF/microwave applications.

Technical Specifications

RF/Microwave Mixers HMC558LC3BRTR attributes and parameters. Explore more RF/Microwave Mixers devices from Analog Devices

Specs

Mounting Feature:

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC12,.12SQ,20

Sub-Category:

RF/Microwave Mixers

Technology:

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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