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HMC158C8

Analog Devices

HMC158C8 by Analog Devices

Analog Devices' HMC158C8 is a GaAs frequency doubler with 50 ohm impedance, operating from 1300 MHz to 4000 MHz. It offers a max conversion loss of 22 dB and can handle up to 27 dBm CW input power. Ideal for RF/microwave applications requiring surface mount components with high-frequency multiplication capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,325 parts In-Stock

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Digiode

USA . 855 parts In-Stock

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Parana Technologies

USA . 2,186 parts In-Stock

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$0.846

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$0.787

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$0.787

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IDEA Electronic Components Group

UK . 973 parts In-Stock

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$0.910

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$0.864

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973

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DigiPath Technology Company

USA . 743 parts In-Stock

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$1.420

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$1.363

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One Stop Electronics

USA . 1,482 parts In-Stock

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$3.000

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Semicontronic

India . 894 parts In-Stock

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$17.000

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$16.575

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$16.490

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894

$17.000

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AZTECH Wire

Italy . 538 parts In-Stock

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$18.999

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Ampacity Inc.

Singapore . 806 parts In-Stock

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$39.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,838 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 885 parts In-Stock

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Corphita

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Overview

Enhance your RF and microwave systems with the HMC158C8 by Analog Devices. With a reputation for excellence in manufacturing, Analog Devices delivers quality components for optimal performance. The HMC158C8, a frequency doubler, offers customers value and reliability with its wide operating frequency range of 1300 MHz to 4000 MHz and low conversion loss of 22 dB. Whether used in telecommunications or radar systems, this ceramic-packaged device is designed to exceed expectations and enhance your applications. Experience the advantages of Analog Devices with the HMC158C8.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent heat dissipation and resistance to temperature fluctuations, ensuring reliability and stability in operation.

Maximum Input Power (CW): 27 dBm

High maximum input power allows for flexibility in system design and operation, providing sufficient power handling capabilities for various applications.

Construction: COMPONENT

Component-based construction enables easy integration into different systems and circuits, offering versatility in usage.

No. of Terminals: 8

Having 8 terminals allows for a secure and stable connection, reducing the risk of signal loss or interference.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures performance consistency under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables operation in cold environments without compromising performance.

Terminal Finish: Gold (Au) - with Nickel (Ni) barrier

Gold terminal finish with nickel barrier provides excellent conductivity, corrosion resistance, and durability for long-term usage.

Technology: GAAS

Gallium Arsenide (GaAs) technology offers high frequency capabilities and low noise performance for efficient frequency doubling.

RF or Microwave Device Type: FREQUENCY DOUBLER

Frequency doubler design allows for doubling the input frequency with high conversion efficiency, making it suitable for frequency multiplication applications.

Characteristic Impedance: 50 ohm

Matching impedance ensures optimal power transfer and signal integrity in RF/microwave systems.

Maximum Conversion Loss: 22 dB

Low conversion loss minimizes signal attenuation during frequency multiplication, maintaining high efficiency in signal processing.

Minimum Operating Frequency: 1300 MHz

Low minimum operating frequency provides flexibility in handling a wide range of input frequencies for frequency doubling applications.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies installation and PCB integration, saving space and facilitating mass production.

Maximum Operating Frequency: 4000 MHz

High maximum operating frequency allows for frequency doubling in the microwave range, meeting the demands of high-frequency applications.

Technical Specifications

RF/Microwave Frequency Multipliers HMC158C8 attributes and parameters. Explore more RF/Microwave Frequency Multipliers devices from Analog Devices

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Conversion Loss:

22 dB

Maximum Input Power (CW):

27 dBm

JESD-609 Code:

e4

Mounting Feature:

No. of Terminals:

8

Maximum Operating Frequency:

4000 MHz

Minimum Operating Frequency:

1300 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOP8,.3

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Frequency Multipliers

Technology:

Terminal Finish:

Gold (Au) - with Nickel (Ni) barrier

Trade Compliance

HMC158C8 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-611-9004, 5962016119004

NIIN

016119004

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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