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ADUC7124BCPZ126-RL

Analog Devices

ADUC7124BCPZ126-RL by Analog Devices

ADUC7124BCPZ126-RL by Analog Devices is a 32-bit microcontroller with ARM7 CPU family, 3.6V max supply voltage, and 41.78MHz clock frequency. Ideal for automotive applications due to its FLASH ROM programmability, DAC/ADC channels, and RISC peripheral IC type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,095 parts In-Stock

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Digiode

USA . 533 parts In-Stock

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Native Components

USA . 189 parts In-Stock

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$0.876

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$0.876

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Northwest PG Solutions

USA . 1,291 parts In-Stock

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$0.964

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Semicontronic

India . 984 parts In-Stock

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$5.000

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$4.875

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$4.850

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984

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Vigor

Singapore . 9,000 parts In-Stock

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$8.970

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AZTECH Wire

Italy . 281 parts In-Stock

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$15.501

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One Stop Electronics

USA . 604 parts In-Stock

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$31.000

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Microchip USA

USA . 4,357 parts In-Stock

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Parana Technologies

USA . 514 parts In-Stock

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$44.749

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IDEA Electronic Components Group

UK . 803 parts In-Stock

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$51.739

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$49.152

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DigiPath Technology Company

USA . 3,018 parts In-Stock

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$80.713

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$77.484

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Corphita

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Overview

Unlock the power of cutting-edge technology with the ADUC7124BCPZ126-RL by Analog Devices. As a leader in microcontroller manufacturing, Analog Devices delivers top-quality products that are perfect for a wide range of applications. From automotive to industrial settings, this microcontroller offers unmatched performance and reliability. With features like DAC and ADC channels, ROM programmability, and PWM channels, customers can expect seamless integration and exceptional functionality. Trust Analog Devices to provide superior solutions that drive innovation and success in your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range for flexibility in power supply options.

Package Shape: SQUARE

Square package shape helps in efficient layout and space utilization on the PCB.

Bit Size: 32

32-bit architecture offers higher processing power and performance for complex applications.

DAC Channels: YES

Integrated DAC channels enable analog output functionality for various applications.

Power Supplies: 3/3.3 V

Supports multiple power supply voltages for compatibility with different systems and components.

No. of Terminals: 64

Sufficient number of terminals for versatile connectivity and interfacing with external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers different package styles for different application requirements and thermal management needs.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage allows for operation in low-power scenarios or battery-powered applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for harsh environments such as automotive applications.

CPU Family: ARM7

ARM-based architecture with proven performance and reliability in embedded systems.

ADC Channels: YES

Built-in ADC channels enable analog input functionality for sensor interfacing and data acquisition.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and reliability in assembly processes.

ROM Words: 129024

Sufficient ROM capacity for storing program instructions and data in embedded applications.

Maximum Seated Height: 1 mm

Low profile package design for space-constrained applications and compact system designs.

Width: 9 mm

Compact width dimension for easy integration and placement on PCBs.

Maximum Clock Frequency: 41.78 MHz

High clock frequency for fast processing and real-time operation in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder joint formation during assembly processes within specified time limits.

Peak Reflow Temperature °C: 260

Sufficiently high peak reflow temperature for reliable soldering and assembly.

Length: 9 mm

Compact length dimension for space-saving integration in compact electronic designs.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive applications, ensuring high reliability and performance in automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with integrated peripheral ICs for efficient processing and interfacing capabilities.

RAM Bytes: 32768

Adequate RAM capacity for data storage and processing in embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and RoHS standards.

Maximum Supply Current: 50 mA

Low supply current consumption for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with common power sources and components.

PWM Channels: YES

Integrated PWM channels for precise control of motor speed, LED brightness, and other applications.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and application enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture during storage and assembly.

Speed: 41.78 rpm

High processing speed for fast data processing and response times in real-time applications.

No. of I/O Lines: 30

Sufficient number of I/O lines for interfacing with external devices and sensors in embedded systems.

Technical Specifications

Microcontrollers ADUC7124BCPZ126-RL attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

41.78 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

129024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

41.78 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

ADUC7124BCPZ126-RL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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