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ADUC7023BCPZ62I-RL

Analog Devices

ADUC7023BCPZ62I-RL by Analog Devices

ADUC7023BCPZ62I-RL by Analog Devices is a 32-bit microcontroller with ARM7 CPU family, operating at up to 44 MHz. It features DAC and ADC channels, 8192 bytes of RAM, and ROM programmability. Ideal for automotive applications due to its wide temperature range (-40 °C to 125°C) and low supply voltage (2.7V).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,661 parts In-Stock

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Digiode

USA . 629 parts In-Stock

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Native Components

USA . 538 parts In-Stock

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$0.314

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$0.302

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Northwest PG Solutions

USA . 476 parts In-Stock

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$0.346

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$0.305

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Vigor

Singapore . 5,000 parts In-Stock

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$4.490

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$4.490

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One Stop Electronics

USA . 1,022 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 782 parts In-Stock

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$8.354

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Andel Nordic

Denmark . 3,721 parts In-Stock

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$12.250

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$8.575

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$8.575

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$8.575

Semicontronic

India . 644 parts In-Stock

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$17.000

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$16.575

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$16.490

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Parana Technologies

USA . 590 parts In-Stock

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$58.850

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$54.731

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IDEA Electronic Components Group

UK . 1,166 parts In-Stock

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$63.280

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$60.116

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DigiPath Technology Company

USA . 2,377 parts In-Stock

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$98.717

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QUARKTWIN TECHNOLOGY LTD

USA . 19,686 parts In-Stock

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Microchip USA

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Corphita

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Overview

Elevate your projects with the ADUC7023BCPZ62I-RL microcontroller from Analog Devices. With a powerful ARM7 CPU family, 32-bit processing capabilities, and a wide range of peripherals including DAC and ADC channels, this microcontroller delivers unmatched performance and versatility. Ideal for automotive applications, this chip carrier package offers a very thin profile, making it perfect for space-constrained designs. Trust Analog Devices, a reputable manufacturer known for quality and reliability, to provide you with the tools you need to bring your ideas to life. Experience the value and benefits of the ADUC7023BCPZ62I-RL today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering of the microcontroller onto a printed circuit board, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Allows for a wide operating voltage range, making the microcontroller versatile and suitable for a variety of applications.

Package Shape: SQUARE

The square package shape provides a compact footprint, optimizing space on the PCB and allowing for efficient placement and routing of components.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex tasks and process data quickly, making it suitable for high-performance applications.

DAC Channels: YES

Having DAC channels allows for analog signal generation, enabling the microcontroller to interface with external analog devices and sensors.

Power Supplies (V): 3/3.3

Compatible with standard power supply voltages, ensuring easy integration into existing systems and designs.

No. of Terminals: 32

With 32 terminals, the microcontroller offers a sufficient number of I/O pins for interfacing with external devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility in thermal management and space constraints, allowing for efficient heat dissipation and slim form factor designs.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures compatibility with various power sources and helps reduce overall power consumption.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the microcontroller can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Technical Specifications

Microcontrollers ADUC7023BCPZ62I-RL attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

44 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

12

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

63488

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

41.78 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

ADUC7023BCPZ62I-RL Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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