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ADL5513ACPZ-WP

Analog Devices

ADL5513ACPZ-WP by Analog Devices

ADL5513ACPZ-WP by Analog Devices is a 16-terminal chip carrier with a temperature range of -40 to 125°C. It operates on a supply voltage b/w 2.7V to 5.5V, making it suitable for automotive applications as a log or antilog amplifier in surface mount configurations. With a compact size of 3x3mm and quad terminal position, it offers precise analog computational capabilities for various electronic systems.

Median Price

$10.794

Lifecycle Status

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8

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1k+

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Rochester

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Nova Conductors

Japan . 197 parts In-Stock

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VNN

France . 5,696 parts In-Stock

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Vyrian

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Digiode

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LWI Electronics Inc

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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Parana Technologies

USA . 2,319 parts In-Stock

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$1.013

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$0.942

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IDEA Electronic Components Group

UK . 2,917 parts In-Stock

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$1.089

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$1.035

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DigiPath Technology Company

USA . 1,106 parts In-Stock

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$1.699

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One Stop Electronics

USA . 2,127 parts In-Stock

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Semicontronic

India . 164 parts In-Stock

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Ampacity Inc.

Singapore . 1,939 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$10.578

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$10.155

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Corohmni

South Africa . 78 parts In-Stock

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Advanced Electronics

New Zealand . 27 parts In-Stock

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$11.118

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$10.562

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Continental Prestige Electronics

USA . 5,432 parts In-Stock

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$8.240

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Aztec Data Supply Inc.

USA . 4,864 parts In-Stock

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AZTECH Wire

Italy . 1,065 parts In-Stock

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Argo Parts USA

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Lucentia Tech

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Overview

Discover the cutting-edge ADL5513ACPZ-WP analog computational chip by Analog Devices, a leading manufacturer known for its top-quality products. This versatile surface-mount device offers a wide range of applications in various industries, from automotive to consumer electronics. With its innovative design and reliable performance, this chip provides customers with exceptional value, efficiency, and accuracy in their projects. Elevate your designs with the superior advantages of the ADL5513ACPZ-WP and experience the difference Analog Devices can make in your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy installation on circuit boards, making the product convenient and efficient to use.

Package Shape: SQUARE

The square package shape ensures a compact design, saving space on the circuit board and enabling efficient use of available real estate.

No. of Terminals: 16

With 16 terminals, this product provides multiple connection options for enhanced versatility and functionality in analog computational applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles of chip carrier, heat sink/slug, and very thin profile offer efficient heat dissipation and compact design, making the product suitable for a variety of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and stability under various operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in extreme temperature environments.

Terminal Finish: MATTE TIN

The matte tin finish provides a durable and reliable terminal surface, ensuring long-term performance and connectivity.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity and ease of installation, making the product user-friendly and efficient.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8mm enables a low-profile design, enhancing the product's compatibility with compact electronic devices.

Width (mm): 3 mm

With a width of 3mm, this product is compact and space-efficient, ideal for applications where board space is limited.

Other IC type: LOG OR ANTILOG AMPLIFIER

The inclusion of a log or antilog amplifier in the product enhances its computational capabilities and versatility in analog signal processing tasks.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7V ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for safe and reliable solder reflow processes during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability in manufacturing processes.

Length: 3 mm

With a length of 3mm, this product offers a compact and space-saving design, making it suitable for applications with limited space constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is designed to withstand the temperature variations and demands of automotive applications, ensuring reliability and durability.

Terminal Form: NO LEAD

The no lead terminal form simplifies the installation process and enhances the product's environmental friendliness by eliminating the use of hazardous materials.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm provides precise and secure connections, ensuring reliable performance and signal integrity in analog computational tasks.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during handling and storage, enhancing its reliability and longevity.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for efficient power management and compatibility with a wide range of power sources, making the product versatile and reliable in various applications.

Technical Specifications

Analog Computational ADL5513ACPZ-WP attributes and parameters. Explore more Analog Computational devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

ADL5513ACPZ-WP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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