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AD8555ACPZ-REEL

Analog Devices

AD8555ACPZ-REEL by Analog Devices

Analog Devices' AD8555ACPZ-REEL is a 16-terminal chip carrier with a nominal voltage of 5V. With a temperature range from -40 to 125 °C, it's ideal for automotive applications. This IC has a max supply current of 2.5mA and operates at a min supply voltage of 2.7V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,777 parts In-Stock

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Digiode

USA . 600 parts In-Stock

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600

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One Stop Electronics

USA . 1,458 parts In-Stock

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$0.500

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$0.500

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Semicontronic

India . 373 parts In-Stock

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$3.500

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$3.412

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$3.395

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373

$3.500

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$3.395

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Vigor

Singapore . 5,475 parts In-Stock

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$4.310

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$4.310

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Ampacity Inc.

Singapore . 219 parts In-Stock

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$5.500

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$5.500

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AZTECH Wire

Italy . 305 parts In-Stock

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$6.167

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$6.167

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Parana Technologies

USA . 2,113 parts In-Stock

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$10.582

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$9.842

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$10.582

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$9.842

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IDEA Electronic Components Group

UK . 2,140 parts In-Stock

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$11.379

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$10.810

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$10.810

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$10.810

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DigiPath Technology Company

USA . 1,409 parts In-Stock

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$17.751

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$17.041

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$17.041

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$17.751

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$17.041

Native Components

USA . 152 parts In-Stock

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$39.113

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$37.548

152

$39.113

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$37.548

Northwest PG Solutions

USA . 345 parts In-Stock

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$43.024

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Corphita

USA . 941 parts In-Stock

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Microchip USA

USA . 479 parts In-Stock

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Overview

Discover the high-quality AD8555ACPZ-REEL by Analog Devices, a versatile analog circuit perfect for a variety of applications. With its surface mount design and compact square package shape, this semiconductor offers reliability and precision in every use. From automotive to industrial settings, this chip carrier with a very thin profile ensures optimal performance even in extreme temperatures. Trust Analog Devices for innovative solutions that deliver exceptional value and superior results. Elevate your projects with the AD8555ACPZ-REEL and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Operates at a commonly used supply voltage, ensuring compatibility with a wide range of systems and applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in design and enable efficient heat dissipation, making this product suitable for compact and high-performance applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for automotive and industrial applications where temperature fluctuations are common.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Width (mm): 4 mm

Compact width allows for space-saving design and integration into smaller electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Supports a low minimum supply voltage, making it suitable for battery-powered devices and energy-efficient applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting, increasing functionality in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product has a moderate level of moisture sensitivity, requiring standard handling procedures during assembly to prevent damage.

Technical Specifications

Other Function Semiconductors AD8555ACPZ-REEL attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

AD8555ACPZ-REEL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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