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AD8124ACPZ-RL

Analog Devices

AD8124ACPZ-RL by Analog Devices

AD8124ACPZ-RL by Analog Devices is a 40-terminal IC with operating temperatures from -40 to 85 °C. It has a supply voltage range of 4.5V to 5.5V and peak reflow temperature of 260°C. This consumer circuit in chip carrier package is ideal for industrial applications requiring high performance and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,841 parts In-Stock

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Digiode

USA . 803 parts In-Stock

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803

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Native Components

USA . 350 parts In-Stock

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$0.461

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$0.442

350

$0.461

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$0.442

Northwest PG Solutions

USA . 1,377 parts In-Stock

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$0.507

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$0.447

1,377

$0.507

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$0.447

Parana Technologies

USA . 1,740 parts In-Stock

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$1.794

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$1.668

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1,740

$1.794

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$1.668

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IDEA Electronic Components Group

UK . 1,205 parts In-Stock

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$1.929

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$1.833

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$1.929

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$1.833

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One Stop Electronics

USA . 298 parts In-Stock

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$2.800

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$2.800

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DigiPath Technology Company

USA . 1,634 parts In-Stock

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$3.009

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$2.889

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$3.009

$2.889

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Vigor

Singapore . 5,263 parts In-Stock

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$8.930

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$8.930

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AZTECH Wire

Italy . 515 parts In-Stock

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$14.113

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Component Stockers USA

USA . 473 parts In-Stock

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$122.960

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$122.960

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QUARKTWIN TECHNOLOGY LTD

USA . 10,747 parts In-Stock

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Microchip USA

USA . 6,182 parts In-Stock

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Corphita

USA . 335 parts In-Stock

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Overview

Elevate your electronic designs with the AD8124ACPZ-RL from Analog Devices, a top-tier manufacturer known for innovative solutions in the consumer IC category. This surface-mount package boasts 40 terminals and a sleek square shape, making it ideal for a wide range of applications. With a temperature range of -40 to 85 °C and a matte tin finish, this chip carrier delivers reliable performance in industrial settings. Experience the value and benefits of this high-quality product, offering customers unmatched precision and efficiency in their projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square packages are more compact and efficient for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring compatibility and performance.

No. of Terminals: 40

Provides ample connectivity options for various input and output signals, enhancing functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier and heat sink design with a thin profile allows for reliable heat dissipation and compact form factor.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, improving versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position offers stable and secure connection with the circuit board.

Maximum Seated Height: 1 mm

Low profile design is ideal for space-constrained applications.

Width: 6 mm

Compact width allows for easy integration into electronic assemblies.

Minimum Supply Voltage (Vsup): 4.5 V

Operates efficiently at low supply voltages, reducing power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for precise temperature control during manufacturing processes, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, suitable for lead-free soldering processes.

Length: 6 mm

Compact length makes it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable performance in harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures compatibility with modern manufacturing processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on circuit boards, saving space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions.

Maximum Supply Voltage (Vsup): 5.5 V

Can safely operate at higher supply voltages, providing flexibility in voltage requirements.

Technical Specifications

Other Function Consumer ICs AD8124ACPZ-RL attributes and parameters. Explore more Other Function Consumer ICs devices from Analog Devices

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

AD8124ACPZ-RL General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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