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AD8000YCPZ-R2

Analog Devices

AD8000YCPZ-R2 by Analog Devices

AD8000YCPZ-R2 by Analog Devices is a small outline, heat sink operational amplifier with 8 terminals. It has a max seated height of 0.9mm and operates at peak reflow temperature of 260 °C. Ideal for automotive applications due to its bipolar technology and moisture sensitivity level of 3.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 11,020 parts In-Stock

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Vyrian

USA . 6,949 parts In-Stock

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Digiode

USA . 849 parts In-Stock

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849

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Vigor

Singapore . 3,251 parts In-Stock

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$2.840

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$2.840

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One Stop Electronics

USA . 1,246 parts In-Stock

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$6.410

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$6.410

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Parana Technologies

USA . 976 parts In-Stock

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$6.471

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$6.018

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$6.471

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IDEA Electronic Components Group

UK . 2,110 parts In-Stock

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$6.958

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$6.610

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2,110

$6.958

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$6.610

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DigiPath Technology Company

USA . 599 parts In-Stock

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$10.854

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$10.420

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$10.420

599

$10.854

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$10.420

AZTECH Wire

Italy . 393 parts In-Stock

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$11.546

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Component Stockers USA

USA . 388 parts In-Stock

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$99.990

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Microchip USA

USA . 2,755 parts In-Stock

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Corphita

USA . 883 parts In-Stock

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Perfect Parts

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510

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Cyclops Electronics Ltd (Excess)

UK . 250 parts In-Stock

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Native Components

USA . 113 parts In-Stock

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Northwest PG Solutions

USA . 62 parts In-Stock

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Overview

Looking to take your projects to the next level? The AD8000YCPZ-R2 by Analog Devices is the answer. With its high-quality manufacturing and top-notch performance, this operational amplifier is perfect for a wide range of applications. Whether you're working on automotive electronics or precision instrumentation, this product delivers unmatched value and reliability. Say goodbye to subpar results and hello to excellence with the AD8000YCPZ-R2.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

Provides a compact design, allowing for efficient use of space on the PCB.

No. of Terminals: 8

Offers flexibility in connectivity options for various circuit configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures heat dissipation efficiency while maintaining a low profile for space-constrained applications.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant surface for soldering connections.

Terminal Position: DUAL

Allows for increased circuit flexibility and offers multiple connection options.

Maximum Seated Height: 0.9 mm

Enables a low-profile design, suitable for compact electronic devices.

Width: 3 mm

Contributes to the overall compactness of the package, saving space on the PCB.

Peak Reflow Temperature °C: 260

Ensures reliable soldering during the assembly process with high-temperature reflow capability.

Length: 3 mm

Contributes to the compactness of the overall package design, suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, meeting the stringent performance and reliability requirements of the automotive industry.

Technology: BIPOLAR

Provides high performance and precision in signal processing, suitable for a wide range of applications.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and provide reliable electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying signals accurately and efficiently in various electronic circuits.

Packing Method: TR

Tape and reel packaging offers easy handling and automated assembly, improving production efficiency.

Terminal Pitch: 0.5 mm

Provides a fine pitch for compact PCB layouts and allows for high-density mounting of components.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring the reliability and longevity of the product.

Technical Specifications

Operational Amplifiers (Op Amps) AD8000YCPZ-R2 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Analog Devices

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Total Terminals:

8

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Trade Compliance

AD8000YCPZ-R2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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