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AD5560JBCZ-REEL

Analog Devices

AD5560JBCZ-REEL by Analog Devices

AD5560JBCZ-REEL by Analog Devices is a 72-terminal IC with a supply voltage range of 8V to 28V. It features a thin profile, fine pitch package style and can withstand peak reflow temperature of 260°C. Ideal for analog circuit applications requiring precise voltage control in compact spaces.

Median Price

$46.714

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 2,000 parts In-Stock

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$46.714

Distributors (In-Stock)

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Vyrian

USA . 6,483 parts In-Stock

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6,483

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Digiode

USA . 692 parts In-Stock

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692

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Native Components

USA . 217 parts In-Stock

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$1.853

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217

$1.853

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Northwest PG Solutions

USA . 292 parts In-Stock

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$2.038

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$2.038

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Parana Technologies

USA . 908 parts In-Stock

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$8.345

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$7.761

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908

$8.345

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$7.761

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

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$8.973

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$8.524

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$8.973

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$8.524

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AZTECH Wire

Italy . 516 parts In-Stock

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$9.520

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DigiPath Technology Company

USA . 1,776 parts In-Stock

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$13.998

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$13.438

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$13.438

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$13.438

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$13.438

Vigor

Singapore . 66,540 parts In-Stock

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$37.520

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Semicontronic

India . 1,591 parts In-Stock

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$39.710

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$38.717

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$38.519

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1,591

$39.710

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$38.519

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Ampacity Inc.

Singapore . 1,906 parts In-Stock

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$86.420

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$86.420

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Corphita

USA . 930 parts In-Stock

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Overview

Transform your electronic designs with the AD5560JBCZ-REEL by Analog Devices, a high-quality semiconductor that promises precision and reliability. Analog Devices is known for its innovative technology and this product is no exception. With a wide range of applications in various industries, this versatile component offers unmatched value and performance. Experience seamless integration and enhanced functionality with the AD5560JBCZ-REEL, setting a new standard in analog circuits. Elevate your projects today with Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, making the product ideal for applications that require resilience.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly processes, saving time and cost in production.

Nominal Supply Voltage (Vsup): 16.5 V

The specific supply voltage of 16.5 V ensures optimal performance and compatibility with other components in the system.

No. of Terminals: 72

Having a high number of terminals allows for more connectivity options and versatility in the product's usage scenarios.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers a compact design with precise terminal placement, making it suitable for space-constrained applications.

Maximum Seated Height: 1.2 mm

The low profile of the product enables it to fit into tight spaces or slim devices, increasing its adaptability in various environments.

Minimum Supply Voltage (Vsup): 8 V

The wide range of supply voltage allows for flexibility in power input requirements, catering to different power sources or system configurations.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand harsh soldering processes without compromising its performance or structural integrity.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the product's resilience to moisture exposure during storage or assembly, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 28 V

The high maximum supply voltage capability allows for compatibility with a wide range of power sources, increasing the product's versatility in different applications.

Technical Specifications

Other Function Semiconductors AD5560JBCZ-REEL attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B72

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Supply Voltage (Vsup):

-5 V

Minimum Negative Supply Voltage (Vsup):

-25 V

Nominal Negative Supply Voltage (Vsup):

-16.5 V

No. of Functions:

1

No. of Terminals:

72

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

16.5 V

Surface Mount:

YES

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

AD5560JBCZ-REEL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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