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AD2S80TE/883B

Analog Devices

AD2S80TE/883B by Analog Devices

AD2S80TE/883B by Analog Devices is a military-grade synchro or resolver to digital converter with BICMOS technology. It operates b/w -55°C to 125°C, has 44 terminals, and uses 5/12V power supplies. Ideal for data acquisition applications requiring precise analog-to-digital conversion in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,763 parts In-Stock

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3,763

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Digiode

USA . 822 parts In-Stock

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822

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Distributors (Availability)

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One Stop Electronics

USA . 1,434 parts In-Stock

1+ parts

$7.000

100+ parts

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1,434

$7.000

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AZTECH Wire

Italy . 344 parts In-Stock

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$15.152

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344

$15.152

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Parana Technologies

USA . 3,424 parts In-Stock

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$24.805

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$23.069

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3,424

$24.805

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$23.069

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IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$26.672

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$25.338

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933

$26.672

$25.338

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DigiPath Technology Company

USA . 3,424 parts In-Stock

1+ parts

$41.608

100+ parts

$39.944

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$39.944

3,424

$41.608

$39.944

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$39.944

Native Components

USA . 287 parts In-Stock

1+ parts

$93.150

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$89.424

287

$93.150

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$89.424

Northwest PG Solutions

USA . 1,811 parts In-Stock

1+ parts

$102.465

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1,811

$102.465

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Corphita

USA . 586 parts In-Stock

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586

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Overview

Upgrade your data acquisition systems with the AD2S80TE/883B from Analog Devices. Trusted for their superior quality and reliability, Analog Devices offers cutting-edge technology to meet your ADC & DAC needs. This military-grade chip carrier features a ceramic package body material and operates seamlessly in extreme temperatures. With 44 terminals and synchro/resolver to digital converter capability, this versatile component provides precise and efficient data conversion. Trust Analog Devices to deliver unmatched performance and value for all your application requirements.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, making them suitable for high temperature operations.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and performance in demanding environments.

Power Supplies (V): 5/12,+-12

Flexible power supply options cater to different voltage requirements, enhancing versatility.

No. of Terminals: 44

Higher number of terminals allow for more connectivity options and functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer compact size and efficient heat dissipation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality in cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and connection reliability.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures performance in rugged applications.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS benefits, such as high speed and low power consumption.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Converter Type: SYNCHRO OR RESOLVER TO DIGITAL CONVERTER

Versatile converter type allows for accurate conversion of synchro or resolver signals into digital data.

Terminal Pitch: 1.27 mm

Fine terminal pitch enables high-density mounting and precise connections.

Technical Specifications

Data Acquisition ADCs & DACs AD2S80TE/883B attributes and parameters. Explore more Data Acquisition ADCs & DACs devices from Analog Devices

Converter Specifications

Technology:

BICMOS

Sub-Category:

Position Converters

Electrical Characteristics

Power Supplies:

5/12,±12 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Form:

Terminal Position:

Quad

No. of Terminals:

44

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Terminal Finish:

Tin/Lead

Packaging

Package Body Material:

Ceramic

Package Style:

Chip Carrier

Package Shape:

Package Code:

Package Equivalence Code:

LCC44,.65SQ

Standards and Codes

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e0

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

AD2S80TE/883B Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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