Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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P0641DF-1E
Littelfuse
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Package Body Material: PLASTIC/EPOXY;
77 V
SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE
150 mA
MS-012AA
R-PDSO-G8
e3
1
1 A
2
8
150 Cel
-40 Cel
PLASTIC/EPOXY
RECTANGULAR
SMALL OUTLINE
260
IEC-61000-4-5; UL RECOGNIZED
Silicon Surge Protectors
YES
MATTE TIN
GULL WING
DUAL
30
SIDAC
P0641DF-1
SIDAC; Surface Mount: YES; Maximum Breakdown Voltage: 77 V; Minimum Operating Temperature: -40 Cel; Maximum Time At Peak Reflow Temperature (s): 30; Maximum Holding Current: 150 mA;
P0721DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Minimum Operating Temperature: -40 Cel;
88 V
P0721DF-1
SIDAC; Surface Mount: YES; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Maximum Operating Temperature: 150 Cel; Peak Reflow Temperature (C): 260;
P0901DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Maximum Holding Current: 150 mA;
98 V
P0901DF-1
SIDAC; Surface Mount: YES; Minimum Operating Temperature: -40 Cel; Moisture Sensitivity Level (MSL): 1; Maximum Breakdown Voltage: 98 V; JESD-609 Code: e3;
P0991DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Maximum Breakdown Voltage: 104 V;
104 V
P1001DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Terminal Form: GULL WING;
110 V
P1101DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Reference Standard: IEC-61000-4-5; UL RECOGNIZED;
130 V
P1101DF-1
SIDAC; Surface Mount: YES; Maximum Breakdown Voltage: 130 V; Maximum Operating Temperature: 150 Cel; Maximum Holding Current: 150 mA; Maximum Time At Peak Reflow Temperature (s): 30;
P1301DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; No. of Elements: 2;
160 V
P1701DF-1E
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SERIES CONNECTED, 2 ELEMENTS WITH BUILT-IN DIODE; Package Shape: RECTANGULAR;
200 V
P0080S1ALRP
SIDAC; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Breakdown Voltage: 25 V; Peak Reflow Temperature (C): NOT SPECIFIED; Minimum Operating Temperature: -40 Cel;
25 V
50 mA
NOT SPECIFIED
P2300S1ALRP
SIDAC; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -40 Cel; Maximum Holding Current: 150 mA; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
260 V
P2600S1ALRP
SIDAC; Surface Mount: YES; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Breakdown Voltage: 300 V; Minimum Operating Temperature: -40 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
300 V
P3500S1ALRP
SIDAC; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Maximum Breakdown Voltage: 400 V; Maximum Holding Current: 150 mA; Peak Reflow Temperature (C): NOT SPECIFIED;
400 V
K1800GRP
SIDAC; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Holding Current: 150 mA; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Maximum Breakdown Voltage: 195 V;
195 V
165 V
SDP0180T023G5RP
SIDAC; Surface Mount: YES; Peak Reflow Temperature (C): NOT SPECIFIED; Minimum Operating Temperature: -40 Cel; Maximum Holding Current: 30 mA; Maximum Breakdown Voltage: 25 V;
30 mA
85 Cel
SDP0240T023G5RP
SIDAC; Surface Mount: YES; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Maximum Operating Temperature: 85 Cel;
35 V
K0900SRP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; Maximum Breakdown Voltage: 97 V;
97 V
79 V
SINGLE
DO-214
R-PDSO-C2
20 A
125 Cel
Not Qualified
C BEND
40
K1800SRP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; Terminal Form: C BEND;
SDP0080Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Terminal Finish: MATTE TIN;
R-PBCC-N8
30 A
CHIP CARRIER
UL RECOGNIZED
NO LEAD
BOTTOM
SDP0242Q12FLRP
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SERIES CONNECTED, 2 ELEMENTS; Moisture Sensitivity Level (MSL): 1;
SERIES CONNECTED, 2 ELEMENTS
S-PBCC-N2
SQUARE
Matte Tin (Sn)
SDP0640Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Non Repetitive Peak On-state Current: 30 A;
SDP0720Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Moisture Sensitivity Level (MSL): 1;
SDP0900Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Peak Reflow Temperature (C): 260;
SDP1100Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Qualification: Not Qualified;
SDP1300Q38CB
SDP1800Q38CB
220 V
SDP3100Q38B
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Minimum Operating Temperature: -40 Cel;
350 V
25 A
SDP2600Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Maximum Time At Peak Reflow Temperature (s): 30;
SDP3100Q38CB
The Littelfuse SDP3100Q38CB is a SIDAC diode with 30A non-repetitive peak current and 150mA holding current. Ideal for AC applications, it has a max breakdown voltage of 350V and operates b/w -40 to 150°C. Suitable for surface mount assembly, this chip carrier package offers UL recognized reliability.
SDP3500Q38CB
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; No. of Terminals: 8;
P0641Q22CLRP
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Package Shape: SQUARE;
P0721Q22CLRP
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; No. of Terminals: 2;
P0901Q22CLRP
P1101Q22CLRP
SIDAC; Package Style (Meter): CHIP CARRIER; Surface Mount: YES; Terminal Position: BOTTOM; Configuration: SINGLE; Package Body Material: PLASTIC/EPOXY;
P1301Q22CLRP
P1701Q22CLRP
K2000SHRP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; Qualification: Not Qualified;
215 V
190 V
K2200SHRP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; JESD-30 Code: R-PDSO-C2;
230 V
205 V
K2400SHRP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; Maximum Time At Peak Reflow Temperature (s): 40;
250 V
K2500SHRP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE; Package Shape: RECTANGULAR;
280 V
240 V
DSLP0080T023G6RP
The Littelfuse DSLP0080T023G6RP is a silicone diode for alternating current (SIDAC) with a max breakdown voltage of 18V. It has a nominal holding current of 40mA and can operate at temperatures up to 150°C. This device is commonly used in applications requiring built-in diode bridges and surface mount capabilities.
18 V
SINGLE WITH BUILT-IN DIODE BRIDGE
40 mA
R-PDSO-G6
6
DSLP0360T023G6RP
SIDAC; Package Style (Meter): SMALL OUTLINE; Surface Mount: YES; Terminal Position: DUAL; Configuration: SINGLE WITH BUILT-IN DIODE BRIDGE; JESD-30 Code: R-PDSO-G6;
48 V
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