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169 Other Function Telecom Interface ICs 4

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
STA8090EXGAJTR by STMicroelectronics

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGAJ by STMicroelectronics

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGATR by STMicroelectronics

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

9 mm

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.65 mm

BOTTOM

NOT SPECIFIED

9 mm

STA8090EXGA by STMicroelectronics

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B169

e3

9 mm

3

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

AEC-Q100

1.2 mm

1.1 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

BALL

.65 mm

BOTTOM

9 mm