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100 Digital Transmission Controllers 9

Digital Transmission Controllers
Part# Info Specs
Part RoHS Manufacturer Description Carrier Type-1 Carrier Type-2 Data Rate ISDN Access Rate JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
DS2154LA2 by Maxim Integrated

DS2154LA2

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G100

e0

14 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

245

Not Qualified

1.6 mm

5 V

YES

CMOS

FRAMER

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

QUAD

14 mm

DS2154LD1 by Maxim Integrated

DS2154LD1

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

CEPT PCM-30/E-1

S-PQFP-G100

e0

14 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

245

5

Not Qualified

1.6 mm

Other Telecom ICs

5 V

YES

CMOS

FRAMER

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

QUAD

14 mm

DS2154LD2 by Maxim Integrated

DS2154LD2

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G100

e0

14 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

245

Not Qualified

1.6 mm

5 V

YES

CMOS

FRAMER

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

QUAD

14 mm

DS2155GB by Maxim Integrated

DS2155GB

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

10 mm

1

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

COMMERCIAL

BALL

.8 mm

BOTTOM

10 mm

DS2155GNB by Maxim Integrated

DS2155GNB

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

10 mm

1

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

INDUSTRIAL

BALL

.8 mm

BOTTOM

10 mm

DS2155GNC2 by Maxim Integrated

DS2155GNC2

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

10 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

INDUSTRIAL

BALL

.8 mm

BOTTOM

10 mm

DS3170N by Maxim Integrated

DS3170N

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

S-PBGA-B100

e0

11 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.3

Not Qualified

1.5 mm

Other Telecom ICs

.145 mA

3.3 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

11 mm

DS3170 by Maxim Integrated

DS3170

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

S-PBGA-B100

e0

11 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.3

Not Qualified

1.5 mm

Other Telecom ICs

.145 mA

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

11 mm

DS2156G by Maxim Integrated

DS2156G

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

e0

10 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

.8 mm

BOTTOM

10 mm