Loading...

LSSOP Cordless Phone ICs 4

Cordless Phone ICs
Part# Info Specs
Part RoHS Manufacturer Description JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SA58640DK,112 by NXP Semiconductors

SA58640DK,112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA58641DK,118 by NXP Semiconductors

SA58641DK,118

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA58641DK,112 by NXP Semiconductors

SA58641DK,112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA58640DK,118 by NXP Semiconductors

SA58640DK,118

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

5 V

YES

CORDLESS TELEPHONE SUPPORT CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm