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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XC95144XL-7CS144C by Xilinx

XC95144XL-7CS144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

107.52 MHz

7.5 ns

CMOS

Programmable Logic Devices

144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95288XL-10CS280I by Xilinx

XC95288XL-10CS280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XCR3256XL-10CS280I by Xilinx

XCR3256XL-10CS280I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XCR3128XL-10CS144C by Xilinx

XCR3128XL-10CS144C

Xilinx

Xilinx XCR3128XL-10CS144C is a 128 macrocell EE PLD with 108 I/O lines, operating at max 95 MHz clock frequency. It features in-system programmability and JTAG boundary scan test for versatile applications in commercial-grade electronics requiring fast propagation delay of 10 ns.

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XCR3128XL-10CS144I by Xilinx

XCR3128XL-10CS144I

Xilinx

Xilinx XCR3128XL-10CS144I is a 128 macrocell EE PLD with 108 I/O lines, operating at up to 95 MHz. It features in-system programmability and JTAG boundary scan test for industrial applications requiring fast propagation delay of 10 ns. The device has a compact square package with thin profile and fine pitch grid array terminals.

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95288XV-10CS280C by Xilinx

XC95288XV-10CS280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B280

e0

Yes

No

XC95288XV-7CS280C by Xilinx

XC95288XV-7CS280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B280

e0

Yes

No

XCR3128XL-7CS144I by Xilinx

XCR3128XL-7CS144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95288XL-7CS280I by Xilinx

XC95288XL-7CS280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XC95144XL-10CS144C by Xilinx

XC95144XL-10CS144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95144XL-10CS144I by Xilinx

XC95144XL-10CS144I

Xilinx

The Xilinx XC95144XL-10CS144I is a 3.3V FLASH PLD with 117 I/O lines, 144 macro cells, and a max clock frequency of 138.88 MHz. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95144XL-5CS144C by Xilinx

XC95144XL-5CS144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95144XL-7CS144I by Xilinx

XC95144XL-7CS144I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC2C128-7CP132C by Xilinx

XC2C128-7CP132C

Xilinx

Xilinx XC2C128-7CP132C is a 128 macrocell FLASH PLD with 100 I/O lines, 119 MHz clock frequency, and 7.5 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

100

Macrocell

100

128

0

100

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C128-7CP132I by Xilinx

XC2C128-7CP132I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

100

Macrocell

100

128

0

100

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C256-7CP132C by Xilinx

XC2C256-7CP132C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 106 I/O

106

Macrocell

106

256

0

106

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C256-7CP132I by Xilinx

XC2C256-7CP132I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 106 I/O

106

Macrocell

106

256

0

106

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C128-6CPG132C by Xilinx

XC2C128-6CPG132C

Xilinx

XC2C128-6CPG132C by Xilinx is a programmable logic device with 128 macro cells and 100 inputs/outputs. It has a max clock frequency of 152 MHz and can be used for applications requiring in-system programmability and high-speed data processing.

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

100

Macrocell

100

128

0

100

152 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

XC2C256-6CPG132C by Xilinx

XC2C256-6CPG132C

Xilinx

The Xilinx XC2C256-6CPG132C is a 256 macrocell FLASH PLD with 106 I/O lines, operating at a max frequency of 139 MHz. It features a propagation delay of 6 ns and can be used in applications requiring programmable logic devices with fast response times and high input/output capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 106 I/O

106

Macrocell

106

256

0

106

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

XC95144XL-10CSG144C by Xilinx

XC95144XL-10CSG144C

Xilinx

XC95144XL-10CSG144C by Xilinx is a programmable logic device (PLD) with 144 macro cells and 117 inputs/outputs. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for in-system programming and outputting macrocell functions at a max clock frequency of 138.88MHz.

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-10CSG144I by Xilinx

XC95144XL-10CSG144I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-5CSG144C by Xilinx

XC95144XL-5CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-7CSG144C by Xilinx

XC95144XL-7CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-7CSG144I by Xilinx

XC95144XL-7CSG144I

Xilinx

The Xilinx XC95144XL-7CSG144I is a FLASH PLD with 117 I/O lines, 144 macro cells, and a max clock frequency of 138.88 MHz. It is used for programmable logic applications requiring in-system programmability and JTAG boundary scan testing in industrial environments.

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95288XL-10CSG280C by Xilinx

XC95288XL-10CSG280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-10CSG280I by Xilinx

XC95288XL-10CSG280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-7CSG280C by Xilinx

XC95288XL-7CSG280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-7CSG280I by Xilinx

XC95288XL-7CSG280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95144XV-7CSG144C by Xilinx

XC95144XV-7CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

Macrocell

144

0

117

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3256XL-10CSG280I by Xilinx

XCR3256XL-10CSG280I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XCR3128XL-10CSG144C by Xilinx

XCR3128XL-10CSG144C

Xilinx

Xilinx XCR3128XL-10CSG144C is a 128 macrocell EE PLD with 10ns propagation delay, operating at 3.3V. Ideal for applications requiring in-system programmability and clock frequencies up to 95MHz. Features include JTAG boundary scan test, 108 I/O lines, and commercial-grade temperature rating.

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-10CSG144I by Xilinx

XCR3128XL-10CSG144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-7CSG144I by Xilinx

XCR3128XL-7CSG144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-6CSG144C by Xilinx

XCR3128XL-6CSG144C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

175 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-7CSG144C by Xilinx

XCR3128XL-7CSG144C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4032ZE-5MN64C by Lattice Semiconductor

LC4032ZE-5MN64C

Lattice Semiconductor

LC4032ZE-5MN64C by Lattice Semiconductor is a 32 macrocell EE PLD with 5.8 ns propagation delay and 149 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features 32 I/O lines, 0.5 mm terminal pitch, and thin profile grid array package style.

EE PLD

Yes

4 Dedicated Inputs, 32 I/O

Macrocell

32

4

32

149 MHz

5.8 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA64,8X8,20

5 mm

5 mm

1.1 mm

Bottom

Ball

64

.5 mm

Tin Silver Copper

S-PBGA-B64

e1

Yes

No

LC4128ZE-7MN144C by Lattice Semiconductor

LC4128ZE-7MN144C

Lattice Semiconductor

LC4128ZE-7MN144C by Lattice Semiconductor is a 128 macrocell EE PLD with 96 I/O lines, 7.5 ns propagation delay, and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability and high-speed data processing in compact electronic designs.

EE PLD

Yes

4 Dedicated Inputs, 96 I/O

Macrocell

128

4

96

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4128ZE-7MN144I by Lattice Semiconductor

LC4128ZE-7MN144I

Lattice Semiconductor

LC4128ZE-7MN144I by Lattice Semiconductor is a 128 macrocell EE PLD with 7.5 ns propagation delay, suitable for applications requiring in-system programmability and a max clock frequency of 111 MHz. With 96 I/O lines and JTAG boundary scan test capability, it offers versatile functionality in a compact grid array package.

EE PLD

Yes

4 Dedicated Inputs, 96 I/O

Macrocell

128

4

96

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4256ZE-5MN144C by Lattice Semiconductor

LC4256ZE-5MN144C

Lattice Semiconductor

LC4256ZE-5MN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 108 I/O lines, 5.8 ns propagation delay, and 149 MHz max clock frequency. Ideal for applications requiring in-system programmability and utilizing surface mount technology for compact designs.

EE PLD

Yes

4 Dedicated Inputs, 108 I/O

Macrocell

256

4

108

149 MHz

5.8 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4256ZE-7MN144C by Lattice Semiconductor

LC4256ZE-7MN144C

Lattice Semiconductor

LC4256ZE-7MN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features a grid array package with thin profile and fine pitch terminals, suitable for high-speed digital designs.

EE PLD

Yes

4 Dedicated Inputs, 108 I/O

Macrocell

256

4

108

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4256ZE-7MN144I by Lattice Semiconductor

LC4256ZE-7MN144I

Lattice Semiconductor

LC4256ZE-7MN144I by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features 108 I/O lines, 0.5 mm terminal pitch, and thin profile grid array package style.

EE PLD

Yes

4 Dedicated Inputs, 108 I/O

Macrocell

256

4

108

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XA2C128-7CPG132I by Xilinx

XA2C128-7CPG132I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

112 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

AEC-Q100

XA2C128-8CPG132Q by Xilinx

XA2C128-8CPG132Q

Xilinx

FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

112 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

125 °C (257 °F)

-40 °C (-40 °F)

Automotive

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

AEC-Q100