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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XC95216-10BG352C by Xilinx

XC95216-10BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

66.7 MHz

10 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-10BG352I by Xilinx

XC95216-10BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

66.7 MHz

10 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-15BG352C by Xilinx

XC95216-15BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-15BG352I by Xilinx

XC95216-15BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-20BG352C by Xilinx

XC95216-20BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

50 MHz

20 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95216-20BG352I by Xilinx

XC95216-20BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 166 I/O

Macrocell

216

0

166

50 MHz

20 ns

CMOS

Programmable Logic Devices

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.4 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-10BG352C by Xilinx

XC95288-10BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

67 MHz

10 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-15BG352C by Xilinx

XC95288-15BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-15BG352I by Xilinx

XC95288-15BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

55.6 MHz

15 ns

CMOS

Programmable Logic Devices

288 Macrocells; Configurable I/O operation with 3.3 V or 5 V

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-20BG352C by Xilinx

XC95288-20BG352C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

50 MHz

20 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No

XC95288-20BG352I by Xilinx

XC95288-20BG352I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

50 MHz

20 ns

CMOS

Programmable Logic Devices

5

4.5 V

5.5 V

3.3/5,5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA352,26X26,50

35 mm

35 mm

1.7 mm

Bottom

Ball

352

1.27 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B352

e0

Yes

No