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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
EP20K100FC324-1V by Altera

EP20K100FC324-1V

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 252 I/O

246

Macrocell

246

4

4160

252

100 MHz

2.5 ns

CMOS

Field Programmable Gate Arrays

2.5

2.375 V

2.625 V

2.5,2.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,18X18,40

19 mm

19 mm

3.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

No

EP20K100FC324-3V by Altera

EP20K100FC324-3V

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 252 I/O

246

Macrocell

246

4

4160

252

3.6 ns

CMOS

Field Programmable Gate Arrays

2.5

2.375 V

2.625 V

2.5,2.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,18X18,40

19 mm

19 mm

3.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

No

EP20K30EFC324-1 by Altera

EP20K30EFC324-1

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 128 I/O

120

Macrocell

120

4

1200

128

160 MHz

1.91 ns

CMOS

Field Programmable Gate Arrays

1.8

1.71 V

1.89 V

1.8,1.8/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,18X18,40

19 mm

19 mm

2.1 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

No

EP20K30EFC324-3 by Altera

EP20K30EFC324-3

Altera

EP20K30EFC324-3 by Altera is a PLD with 1200 logic cells, 120 inputs, and 120 outputs. It operates at a max clock frequency of 160MHz and has a propagation delay of 3.98ns. Ideal for applications requiring high-speed processing in electronics design.

Loadable PLD

4 Dedicated Inputs, 128 I/O

120

Macrocell

120

4

1200

128

160 MHz

3.98 ns

CMOS

Field Programmable Gate Arrays

1.8

1.71 V

1.89 V

1.8,1.8/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,18X18,40

19 mm

19 mm

2.1 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

No

XCR3512XL-10FG324C by Xilinx

XCR3512XL-10FG324C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XCR3512XL-10FG324I by Xilinx

XCR3512XL-10FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XCR3384XL-10FG324I by Xilinx

XCR3384XL-10FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 220 I/O

Macrocell

384

0

220

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B324

e0

Yes

No

XCR3512XL-12FG324I by Xilinx

XCR3512XL-12FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-10FG324C by Xilinx

XC2C512-10FG324C

Xilinx

Xilinx XC2C512-10FG324C is a 512 macrocell FLASH PLD with 270 I/O lines, operating at max 91 MHz clock frequency. It has a propagation delay of 10 ns and can handle supply voltages from 1.7V to 1.9V. Ideal for applications requiring high-speed programmable logic in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-10FG324I by Xilinx

XC2C512-10FG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-7FG324C by Xilinx

XC2C512-7FG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C384-10FG324I by Xilinx

XC2C384-10FG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C384-10FGG324C by Xilinx

XC2C384-10FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C384-10FGG324I by Xilinx

XC2C384-10FGG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-10FGG324C by Xilinx

XC2C512-10FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-10FGG324I by Xilinx

XC2C512-10FGG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-7FGG324C by Xilinx

XC2C512-7FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XCR3512XL-10FGG324I by Xilinx

XCR3512XL-10FGG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No