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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XC95288XL-10CS280I by Xilinx

XC95288XL-10CS280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XCR3256XL-10CS280I by Xilinx

XCR3256XL-10CS280I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XC95288XV-10CS280C by Xilinx

XC95288XV-10CS280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B280

e0

Yes

No

XC95288XV-7CS280C by Xilinx

XC95288XV-7CS280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B280

e0

Yes

No

XC95288XL-7CS280I by Xilinx

XC95288XL-7CS280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XC95288XL-10CSG280C by Xilinx

XC95288XL-10CSG280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-10CSG280I by Xilinx

XC95288XL-10CSG280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-7CSG280C by Xilinx

XC95288XL-7CSG280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-7CSG280I by Xilinx

XC95288XL-7CSG280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XCR3256XL-10CSG280I by Xilinx

XCR3256XL-10CSG280I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No