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TFBGA Serial Communication Controllers 7

Serial Communication Controllers
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency Communication Protocol DAC Channels DMA Channels Data Encoding or Decoding Method Maximum Data Transfer Rate Drive Interface Standard External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Connectivity Peripherals
SC16C850IET,151 by NXP Semiconductors

SC16C850IET,151

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

IT ALSO NEED 3.3V SUPPLY

80 MHz

S-PBGA-B36

e1

3.5 mm

YES

1

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

2.5/3.3

Not Qualified

1.15 mm

Serial IO/Communication Controllers

2.75 V

2.25 V

2.5 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SC16C850LIET,115 by NXP Semiconductors

SC16C850LIET,115

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

3

NO

80 MHz

ASYNC, BIT

NRZ

.625 MBps

8

S-PBGA-B36

e1

3.5 mm

YES

1

1

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.8

Not Qualified

1.15 mm

Serial IO/Communication Controllers

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SC16C852VIET,115 by NXP Semiconductors

SC16C852VIET,115

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

8

NO

80 MHz

ASYNC, BIT

NRZ

.625 MBps

8

S-PBGA-B36

e1

3.5 mm

YES

1

2

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.8

Not Qualified

1.15 mm

Serial IO/Communication Controllers

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SC16C852VIET,151 by NXP Semiconductors

SC16C852VIET,151

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

8

NO

80 MHz

ASYNC, BIT

NRZ

.625 MBps

8

S-PBGA-B36

e1

3.5 mm

YES

1

2

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.8

Not Qualified

1.15 mm

Serial IO/Communication Controllers

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SC16C852SVIET,115 by NXP Semiconductors

SC16C852SVIET,115

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

8

NO

80 MHz

ASYNC, BIT

NRZ

.0000012122176018 MBps

8

S-PBGA-B36

e1

3.5 mm

YES

1

2

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.8

Not Qualified

1.15 mm

Serial IO/Communication Controllers

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SC16C852SVIET,151 by NXP Semiconductors

SC16C852SVIET,151

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

8

NO

80 MHz

ASYNC, BIT

NRZ

.0000012122176018 MBps

8

S-PBGA-B36

e1

3.5 mm

YES

1

2

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.8

Not Qualified

1.15 mm

Serial IO/Communication Controllers

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SC16C850IET,157 by NXP Semiconductors

SC16C850IET,157

NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: SQUARE;

CAN ALSO OPERATE AT 2.5V SUPPLY

3

NO

80 MHz

ASYNC, BIT

.625 MBps

8

S-PBGA-B36

e1

3.5 mm

YES

1

1

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA36,6X6,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

2.5/3.3

Not Qualified

1.15 mm

Serial IO/Communication Controllers

3.6 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

3.5 mm

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL