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4072 Other Function uPs,uCs & Peripheral ICs 3

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVP1802-2MSELSVC4072 by Xilinx

XCVP1802-2MSELSVC4072

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4072; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B4072

65 mm

4072

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA4072,64X64,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.56 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

1 mm

BOTTOM

65 mm

MICROPROCESSOR CIRCUIT

XCVP1802-2MLELSVC4072 by Xilinx

XCVP1802-2MLELSVC4072

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4072; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;

S-PBGA-B4072

65 mm

4072

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA4072,64X64,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.56 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

1 mm

BOTTOM

65 mm

MICROPROCESSOR CIRCUIT

XCVP1802-1MSELSVC4072 by Xilinx

XCVP1802-1MSELSVC4072

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4072; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B4072

65 mm

4072

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA4072,64X64,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.56 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

1 mm

BOTTOM

65 mm

MICROPROCESSOR CIRCUIT