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27 Other Function uPs,uCs & Peripheral ICs 3

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
HTCM400/EAE,122 by NXP Semiconductors

HTCM400/EAE,122

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: OTHER; No. of Terminals: 27; Maximum Supply Current: 100 mA; Maximum Operating Temperature: 85 Cel; Package Body Material: PLASTIC/EPOXY;

27

85 Cel

-25 Cel

PLASTIC/EPOXY

MODULE,27LEAD,1

MICROELECTRONIC ASSEMBLY

5

Not Qualified

Other uPs/uCs/Peripheral ICs

100 mA

5 V

OTHER

LC898124EP2XC-MH by Onsemi

LC898124EP2XC-MH

Onsemi

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 27; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B27

e1

3.89 mm

1

27

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.33 mm

3.3 V

2.6 V

2.8 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.3 mm

MICROPROCESSOR CIRCUIT

JN5169-001-M03-2 by NXP Semiconductors

JN5169-001-M03-2

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 27; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-N27

21 mm

27

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.6 V

2 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

UNSPECIFIED

16 mm

MICROPROCESSOR CIRCUIT